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AS4C4M16D1A-5TINTR with pin details, that includes DDR1 Type, they are designed to operate with a Tape & Reel (TR) Alternate Packaging Packaging, Mounting Style is shown on datasheet note for use in a SMD/SMT, that offers Package Case features such as 66-TSSOP (0.400", 10.16mm Width), it has an Operating Temperature range of -40°C ~ 85°C (TA), as well as the Parallel Interface, the device can also be used as 2.3 V ~ 2.7 V Voltage Supply. In addition, the Supplier Device Package is 66-TSOP II, the device is offered in 64M (4M x 16) Memory Size, the device has a DDR SDRAM of Memory Type, and Speed is 200MHz, and the Format Memory is RAM, it has an Maximum Operating Temperature range of + 85 C, it has an Minimum Operating Temperature range of - 40 C, and Organization is 4 M x 16, and the Data Bus Width is 16 bit, and Supply Voltage Max is 2.7 V, and the Supply Voltage Min is 2.3 V, and Maximum Clock Frequency is 200 MHz.
AS4C4M16S-6BINTR with user guide, that includes 3 V ~ 3.6 V Voltage Supply, they are designed to operate with a 54-TFBGA (8x8) Supplier Device Package, Speed is shown on datasheet note for use in a 166MHz, that offers Packaging features such as Tape & Reel (TR) Alternate Packaging, Package Case is designed to work in 54-TFBGA, it has an Operating Temperature range of -40°C ~ 85°C (TA), the device can also be used as SDRAM Memory Type. In addition, the Memory Size is 64M (4M x 16), the device is offered in Parallel Interface, the device has a RAM of Format Memory.
The AS4C4M16S-6BIN is IC SDRAM 64M 4MX16 54FBGA, that includes RAM Format Memory, they are designed to operate with a Parallel Interface, Memory Size is shown on datasheet note for use in a 64M (4M x 16), that offers Memory Type features such as SDRAM, it has an Operating Temperature range of -40°C ~ 85°C (TA), as well as the 54-TFBGA Package Case, the device can also be used as Tray Packaging. In addition, the Speed is 166MHz, the device is offered in 54-TFBGA (8x8) Supplier Device Package, the device has a 3 V ~ 3.6 V of Voltage Supply.
