9icnet provides you with PL-1-3-1016-H designed and produced by Wakefield-Vette, which is sold in 9icnet on the spot, and can be purchased through channels such as the original factory and agents. PL-1-3-1016-H price reference $9.97000. Wakefield-Vette PL-1-3-1016-H Package/Specification: THERM PAD 101.6MMX101.6MM GREEN. You can download PL-1-3-1016-H english data, pin diagram, Datasheet data sheet function manual, the data contains detailed pin diagrams of diode rectifiers, application circuit diagrams of functions, voltages, usage methods and tutorials.
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The 06-1508-20 is CONN IC DIP SOCKET 6POS GOLD, that includes 508 Series, they are designed to operate with a DIP, 0.2" (5.08mm) Row Spacing Type, Packaging is shown on datasheet note for use in a Bulk, that offers Termination features such as Wire Wrap, it has an Operating Temperature range of -55°C ~ 105°C, as well as the Through Hole Mounting Type, the device can also be used as Closed Frame Features. In addition, the Housing Material is Polyamide (PA46), Nylon 4/6, the device is offered in 6 (2 x 3) Number of Positions or Pins Grid, the device has a 0.100" (2.54mm) of Pitch Mating, and Contact Finish Mating is Gold, and the Pitch Post is 0.100" (2.54mm), and Contact Finish Post is Tin, and the Contact Finish Thickness Mating is 10μin (0.25μm), and Contact Material Mating is Beryllium Copper, and the Contact Finish Thickness Post is 200μin (5.08μm), and Contact Material Post is Brass.
The 06-1508-21 is CONN IC DIP SOCKET 6POS GOLD, that includes DIP, 0.2" (5.08mm) Row Spacing Type, they are designed to operate with a Wire Wrap Termination, Series is shown on datasheet note for use in a 508, that offers Pitch Post features such as 0.100" (2.54mm), Pitch Mating is designed to work in 0.100" (2.54mm), as well as the Bulk Packaging, it has an Operating Temperature range of -55°C ~ 125°C. In addition, the Number of Positions or Pins Grid is 6 (2 x 3), the device is offered in Through Hole Mounting Type, the device has a Polyamide (PA46), Nylon 4/6 of Housing Material, and Features is Closed Frame, and the Contact Material Post is Brass, and Contact Material Mating is Beryllium Copper, and the Contact Finish Thickness Post is 10μin (0.25μm), and Contact Finish Thickness Mating is 10μin (0.25μm), and the Contact Finish Post is Gold, and Contact Finish Mating is Gold.
The 06-1508-30 is CONN IC DIP SOCKET 6POS GOLD, that includes Gold Contact Finish Mating, they are designed to operate with a Tin Contact Finish Post, Contact Finish Thickness Mating is shown on datasheet note for use in a 10μin (0.25μm), that offers Contact Finish Thickness Post features such as 200μin (5.08μm), Contact Material Mating is designed to work in Beryllium Copper, as well as the Brass Contact Material Post, the device can also be used as Closed Frame Features. In addition, the Housing Material is Polyamide (PA46), Nylon 4/6, the device is offered in Through Hole Mounting Type, the device has a 6 (2 x 3) of Number of Positions or Pins Grid, it has an Operating Temperature range of -55°C ~ 105°C, and the Packaging is Bulk, and Pitch Mating is 0.100" (2.54mm), and the Pitch Post is 0.100" (2.54mm), and Series is 508, and the Termination is Wire Wrap, and Type is DIP, 0.2" (5.08mm) Row Spacing.
The 06-1508-31 is CONN IC DIP SOCKET 6POS GOLD, that includes Wire Wrap Termination, they are designed to operate with a Through Hole Mounting Type, Housing Material is shown on datasheet note for use in a Polyamide (PA46), Nylon 4/6, that offers Contact Finish Mating features such as Gold, Contact Finish Post is designed to work in Gold, as well as the DIP, 0.2" (5.08mm) Row Spacing Type, the device can also be used as Closed Frame Features. In addition, the Packaging is Bulk, the device is offered in Brass Contact Material Post, the device has a Beryllium Copper of Contact Material Mating, and Number of Positions or Pins Grid is 6 (2 x 3), it has an Operating Temperature range of -55°C ~ 125°C, and Series is 508, and the Contact Finish Thickness Mating is 10μin (0.25μm), and Contact Finish Thickness Post is 10μin (0.25μm), and the Pitch Mating is 0.100" (2.54mm), and Pitch Post is 0.100" (2.54mm).
