The 550109PA02F1 parts manufactured by NELTRON are available for purchase at 9icnet Electronics. Here you can find various types and values of electronic parts from the world's leading manufacturers. The 550109PA02F1 components of 9icnet Electronics are carefully chosen, undergo stringent quality control, and are successfully meet all required standards.
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550-10-600M35-001166 with pin details, that includes 550 Series, they are designed to operate with a BGA Type, Packaging is shown on datasheet note for use in a Bulk, that offers Termination features such as Solder, it has an Operating Temperature range of -55°C ~ 125°C, as well as the Through Hole Mounting Type, the device can also be used as Closed Frame Features. In addition, the Housing Material is FR4 Epoxy Glass, the device is offered in 600 (35 x 35) Number of Positions or Pins Grid, the device has a 0.050" (1.27mm) of Pitch Mating, and Contact Finish Mating is Gold, and the Pitch Post is 0.050" (1.27mm), and Contact Finish Post is Gold, and the Contact Finish Thickness Mating is 10μin (0.25μm), and Contact Material Mating is Beryllium Copper, and the Contact Finish Thickness Post is 10μin (0.25μm), and Contact Material Post is Brass.
550-10-652M35-001166 with user guide, that includes BGA Type, they are designed to operate with a Solder Termination, Series is shown on datasheet note for use in a 550, that offers Pitch Post features such as 0.050" (1.27mm), Pitch Mating is designed to work in 0.050" (1.27mm), as well as the Bulk Packaging, it has an Operating Temperature range of -55°C ~ 125°C. In addition, the Number of Positions or Pins Grid is 652 (35 x 35), the device is offered in Through Hole Mounting Type, the device has a FR4 Epoxy Glass of Housing Material, and Features is Closed Frame, and the Contact Material Post is Brass, and Contact Material Mating is Beryllium Copper, and the Contact Finish Thickness Post is 10μin (0.25μm), and Contact Finish Thickness Mating is 10μin (0.25μm), and the Contact Finish Post is Gold, and Contact Finish Mating is Gold.
550-10-600M35-001152 with circuit diagram, that includes Gold Contact Finish Mating, they are designed to operate with a Gold Contact Finish Post, Contact Finish Thickness Mating is shown on datasheet note for use in a 10μin (0.25μm), that offers Contact Finish Thickness Post features such as 10μin (0.25μm), Contact Material Mating is designed to work in Brass, as well as the Brass Contact Material Post, the device can also be used as Closed Frame Features. In addition, the Housing Material is FR4 Epoxy Glass, the device is offered in Through Hole Mounting Type, the device has a 600 (35 x 35) of Number of Positions or Pins Grid, it has an Operating Temperature range of -55°C ~ 125°C, and the Packaging is Bulk, and Pitch Mating is 0.050" (1.27mm), and the Pitch Post is 0.050" (1.27mm), and Series is 550, and the Termination is Solder, and Type is BGA.
550-10-652M35-001152 with EDA / CAD Models, that includes Through Hole Mounting Type, they are designed to operate with a Solder Termination, Contact Finish Mating is shown on datasheet note for use in a Gold, that offers Contact Finish Post features such as Gold, Housing Material is designed to work in FR4 Epoxy Glass, as well as the Closed Frame Features, the device can also be used as Bulk Packaging. In addition, the Contact Material Mating is Brass, the device is offered in Brass Contact Material Post, the device has a BGA of Type, and Number of Positions or Pins Grid is 652 (35 x 35), and the Series is 550, it has an Operating Temperature range of -55°C ~ 125°C, and the Contact Finish Thickness Mating is 10μin (0.25μm), and Contact Finish Thickness Post is 10μin (0.25μm), and the Pitch Mating is 0.050" (1.27mm), and Pitch Post is 0.050" (1.27mm).
