9icnet provides you with 74LVT16244BDGG,112 designed and produced by NXP USA Inc., which is sold in 9icnet on the spot, and can be purchased through channels such as the original factory and agents. 74LVT16244BDGG,112 price reference $0.34000. NXP USA Inc. 74LVT16244BDGG,112 Package/Specification: IC BUFF DVR TRI-ST 16BIT 48TSSOP. You can download 74LVT16244BDGG,112 english data, pin diagram, Datasheet data sheet function manual, the data contains detailed pin diagrams of diode rectifiers, application circuit diagrams of functions, voltages, usage methods and tutorials.
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The 74LVT16244BBX,518 is IC BUFFER/DVR 16BIT 3ST 60HXQFN, that includes 74LVT Series, they are designed to operate with a Tape & Reel (TR) Packaging, Package Case is shown on datasheet note for use in a 60-XFQFN Dual Rows, Exposed Pad, it has an Operating Temperature range of -40°C ~ 125°C, Mounting Type is designed to work in Surface Mount, as well as the 2.7 V ~ 3.6 V Voltage Supply, the device can also be used as 60-HXQFN (4x6) Supplier Device Package. In addition, the Number of Elements is 4, the device is offered in 32mA, 64mA Current Output High Low, the device has a Buffer/Line Driver, Non-Inverting of Logic Type, and Number of Bits per Element is 4.
The 74LVT16244BBQ,518 is IC BUFFER/DVR 16BIT 3ST 60HUQFN, that includes 2.7 V ~ 3.6 V Voltage Supply, they are designed to operate with a 60-HUQFN (4x6) Supplier Device Package, Series is shown on datasheet note for use in a 74LVT, that offers Packaging features such as Digi-ReelR, Package Case is designed to work in 60-UFQFN Dual Rows, Exposed Pad, it has an Operating Temperature range of -40°C ~ 85°C, the device can also be used as 4 Number of Elements. In addition, the Number of Bits per Element is 4, the device is offered in Surface Mount Mounting Type, the device has a Buffer/Line Driver, Non-Inverting of Logic Type, and Current Output High Low is 32mA, 64mA.
74LVT16244BDGG with circuit diagram manufactured by NXP. The 74LVT16244BDGG is available in TSSOP48 Package, is part of the IC Chips.
