9icnet provides you with C2012C0G1H271J designed and produced by TDK Corporation, which is sold in 9icnet on the spot, and can be purchased through channels such as the original factory and agents. C2012C0G1H271J price reference $1.58. TDK Corporation C2012C0G1H271J Package/Specification: CAP CER 270PF 50V C0G 0805. You can download C2012C0G1H271J english data, pin diagram, Datasheet data sheet function manual, the data contains detailed pin diagrams of diode rectifiers, application circuit diagrams of functions, voltages, usage methods and tutorials.
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C2012C0G1H223K125AA with pin details, that includes C Series, they are designed to operate with a Digi-ReelR Alternate Packaging Packaging, Package Case is shown on datasheet note for use in a 0805 (2012 Metric), that offers Capacitance features such as 0.022μF, it has an Operating Temperature range of -55°C ~ 125°C, as well as the Surface Mount, MLCC Mounting Type, the device can also be used as Low ESL Features. In addition, the Voltage Rated is 50V, the device is offered in 0.079" L x 0.049" W (2.00mm x 1.25mm) Size Dimension, the device has a General Purpose of Applications, and Tolerance is ±10%, and the Temperature Coefficient is C0G, NP0, and Thickness Max is 0.057" (1.45mm).
The C2012C0G1H223J125AA is CAP CER 0.022UF 50V C0G 0805, that includes 50V Voltage Rated, they are designed to operate with a ±5% Tolerance, Thickness Max is shown on datasheet note for use in a 0.057" (1.45mm), that offers Temperature Coefficient features such as C0G, NP0, Size Dimension is designed to work in 0.079" L x 0.049" W (2.00mm x 1.25mm), as well as the C Series, the device can also be used as Digi-ReelR Alternate Packaging Packaging. In addition, the Package Case is 0805 (2012 Metric), it has an Operating Temperature range of -55°C ~ 125°C, the device has a Surface Mount, MLCC of Mounting Type, and Features is Low ESL, and the Capacitance is 0.022μF, and Applications is General Purpose.
C2012C0G1H270JT with circuit diagram manufactured by TDK. The C2012C0G1H270JT is available in SMD Package, is part of the IC Chips.
