久芯网

LCMXO3D-4300ZC-3SG72C

  • 描述:电源电压: 2.375伏~3.465伏 供应商设备包装: 72-QFN (10x10) 工作温度: 0摄氏度~85摄氏度(TJ) 安装类别: 表面安装
  • 品牌: 莱迪思 (Lattice)
  • 交期:5-7 工作日
渠道:
  • 自营
  • 得捷
  • 贸泽

起订量: 168

  • 库存: 0
  • 单价: ¥121.46343
  • 数量:
    - +
  • 总计: ¥20,405.86
在线询价

温馨提示: 请填写以下信息,以便客户代表及时与您沟通联系。

规格参数

  • 制造厂商 莱迪思 (Lattice)
  • 部件状态 可供货
  • 闸门数量 -
  • 安装类别 表面安装
  • 工作温度 0摄氏度~85摄氏度(TJ)
  • RAM 总位数 94208
  • 电源电压 2.375伏~3.465伏
  • 逻辑阵列块/可配置逻辑块数量 538
  • 逻辑元件/单元的数量 4300
  • 输入/输出数量 58
  • 包装/外壳 72-QFN
  • 供应商设备包装 72-QFN (10x10)

LCMXO3D-4300ZC-3SG72C 产品详情

MachXO3TM device family is an Ultra-Low Density family that supports the most advanced programmable bridging and IO expansion. It has the breakthrough IO density and the lowest cost per IO. The device IO features have the integrated support for latest industry standard IO. The MachXO3L/LF family of low power, instant-on, non-volatile PLDs has five devices with densities ranging from 640 to 6900 Look-Up Tables (LUTs). In addition to LUT-based, low-cost programmable logic these devices feature Embedded Block RAM (EBR), Distributed RAM, Phase Locked Loops (PLLs), pre-engineered source synchronous I/O support, advanced configuration support including dual-boot capability and hardened versions of commonly used functions such as SPI controller, I2 C controller and timer/counter. MachXO3LF devices also support User Flash Memory (UFM). These features allow these devices to be used in low cost, high volume consumer and system applications.

Feature

1.1.1. Solutions 

 Smallest footprint, lowest power, high data throughput bridging solutions for mobile applications 

 Optimized footprint, logic density, IO count, IO performance devices for IO management and logic applications 

 High IO/logic, lowest cost/IO, high IO devices for IO expansion applications 

1.1.2. Flexible Architecture 

 Logic Density ranging from 64 to 9.4K LUT4 

 High IO to LUT ratio with up to 384 IO pins 

1.1.3. Advanced Packaging 

 0.4 mm pitch: 1K to 4K densities in very small footprint WLCSP (2.5 mm × 2.5 mm to 3.8 mm × 3.8 mm) with 28 to 63 IOs 

 0.5 mm pitch: 640 to 9.4K LUT densities in 6 mm x 6 mm to 10 mm x 10 mm BGA packages with up to 281 IOs 

 0.8 mm pitch: 1K to 9.4K densities with up to 384 IOs in BGA packages 

1.1.4. Pre-Engineered Source Synchronous I/O 

 DDR registers in I/O cells 

 Dedicated gearing logic 

 7:1 Gearing for Display I/Os 

 Generic DDR, DDRx2, DDRx4 

1.1.5. High Performance, Flexible I/O Buffer 

 Programmable sysIO™ buffer supports wide range of interfaces: 

 LVCMOS 3.3/2.5/1.8/1.5/1.2 

 LVTTL 

 LVDS, Bus-LVDS, MLVDS, LVPECL 

 MIPI D-PHY Emulated 

 Schmitt trigger inputs, up to 0.5 V hysteresis 

 Ideal for IO bridging applications 

 I/Os support hot socketing 

 On-chip differential termination 

 Programmable pull-up or pull-down mode

1.1.6. Flexible On-Chip Clocking 

 Eight primary clocks 

 Up to two edge clocks for high-speed I/O interfaces (top and bottom sides only) 

 Up to two analog PLLs per device with fractional-n frequency synthesis 

 Wide input frequency range (7 MHz to 400 MHz). 

1.1.7. Non-volatile, Multi-time Programmable 

 Instant-on 

 Powers up in microseconds 

 Optional dual boot with external SPI memory 

 Single-chip, secure solution 

 Programmable through JTAG, SPI or I2C 

 MachXO3L includes multi-time programmable NVCM 

 MachXO3LF reconfigurable Flash includes 100,000 write/erase cycle 

 Supports background programming of non-volatile memory 

1.1.8. TransFR Reconfiguration 

 In-field logic update while IO holds the system state 

1.1.9. Enhanced System Level Support 

 On-chip hardened functions: SPI, I2C, timer/counter 

 On-chip oscillator with 5.5% accuracy 

 Unique TraceID for system tracking 

 Single power supply with extended operating range 

 IEEE Standard 1149.1 boundary scan 

 IEEE 1532 compliant in-system programming

Applications

 Consumer Electronics 

 Compute and Storage 

 Wireless Communications 

 Industrial Control Systems 

 Automotive System


LCMXO3D-4300ZC-3SG72C所属分类:现场可编程门阵列(FPGA),LCMXO3D-4300ZC-3SG72C 由 莱迪思 (Lattice) 设计生产,可通过久芯网进行购买。LCMXO3D-4300ZC-3SG72C价格参考¥121.463433,你可以下载 LCMXO3D-4300ZC-3SG72C中文资料、PDF数据手册、Datasheet数据手册功能说明书,可查询LCMXO3D-4300ZC-3SG72C规格参数、现货库存、封装信息等信息!

莱迪思 (Lattice)

莱迪思 (Lattice)

莱迪思半导体是低功耗可编程的领导者。在不断增长的通信、计算、工业、汽车和消费市场中,他们通过网络解决客户问题,从边缘到云。他们的技术、长期关系以及对世界一流支持的承诺,让他们的客户能够快速、轻松地释放他...

展开
会员中心 微信客服
客服
回到顶部