A7102CHTK2/T0BC2CJ is a ready-to-use secure element for IoT devices providing a root of trust at the IC level and delivers, chip-to-cloud security right out of the box, so you can safely connect to IoT clouds and services, including AWS, IBM Watson IoT™ Platform, and Google Cloud™ IoT Core without writing security code or exposing keys.
Complete Product Support PackageDelivered as a ready-to-use solution, the A7102CHTK2/T0BC2CJ includes a complete product support package that simplifies design-in and reduces time-to-market. NXP® eases the overall design process in several ways. For example, the use of an OpenSSL engine and integration into mbedTLS makes it easier to work with connectivity stacks. NXP also offers time-saving design tools like sample code for major use cases, extensive application notes, and compatible development kits fori.MX and Kinetis® microcontrollers, which accelerate the final system integration.
Feature
- Secure, zero-touch connectivity
- End-to-end security, from chip to edge to cloud
- Secure credential injection for root of trust at IC level
- Protected access to credentials
- Fast design-in with complete product support package
- Easy to integrate with different MCU and MPU platforms
- Encrypted/authenticated interface to host processor
- ECC-based authentication
- TLS set-up (TLS-PKI, TLS-PSK)
- Connectionless message authentication (HMAC)
- Protected storage for product master secrets with key wrapping and key derivation functions, key locking mechanism
- Optional trust provisioning by NXP and qualified partners
- Standard (-25 to +85 °C, A7101) and extended (-40 to +90 °C, A7102) temp ranges
- HVSON8 (4x4 mm) and WLCSP (2x2 mm) package
