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The DF38002FP4V is IC MCU 8BIT 16KB FLASH 64LQFP, that includes H8R H8/300L SLP Series, they are designed to operate with a Tray Packaging, Package Case is shown on datasheet note for use in a 64-LQFP, it has an Operating Temperature range of -20°C ~ 75°C (TA), Supplier Device Package is designed to work in 64-LQFP (10x10), as well as the 39 Number of I O, the device can also be used as 4MHz Speed. In addition, the Core Processor is H8/300L, the device is offered in 1K x 8 RAM Size, the device has a FLASH of Program Memory Type, and Peripherals is LCD, PWM, WDT, and the Connectivity is SCI, and Voltage Supply Vcc Vdd is 1.8 V ~ 5.5 V, and the Core Size is 8-Bit, and Program Memory Size is 16KB (16K x 8), and the Data Converters is A/D 4x10b, and Oscillator Type is Internal.
The DF37SB-60DS-0.4V(51) is CONN RCPT 60POS 0.4MM SMD GOLD, that includes DF37 Series, they are designed to operate with a 0.016" (0.40mm) Pitch, Packaging is shown on datasheet note for use in a Tape & Reel (TR), that offers Number of Rows features such as 2, Number of Positions is designed to work in 60, as well as the Surface Mount Mounting Type, the device can also be used as 0.98mm Mated Stacking Heights. In addition, the Height Above Board is 0.038" (0.97mm), the device is offered in Solder Retention Features, the device has a 2μin (0.05μm) of Contact Finish Thickness, and Contact Finish is Gold, and the Connector Type is Receptacle, Center Strip Contacts.
The DF38002FP10V is MCU 16-bit CISC 16KB ROM 2.5V/3.3V 64-Pin LQFP manufactured by RENESAS. The DF38002FP10V is available in LQFP64 Package, is part of the IC Chips, , and with support for MCU 16-bit CISC 16KB ROM 2.5V/3.3V 64-Pin LQFP.
