These devices have robust 3.3-V drivers and receivers in a small package for demandingindustrial applications. The bus pins are robust to ESD events with high levels of protection toHuman-Body Model and IEC Contact Discharge specifications.
Each of these devices combines a differential driver and a differential receiver whichoperate from a single 3.3-V power supply. The driver differential outputs and the receiverdifferential inputs are connected internally to form a bus port suitable for half-duplex (two-wirebus) communication. These devices feature a wide common-mode voltage range making the devicessuitable for multi-point applications over long cable runs. These devices are characterized from–40°C to 125°C.
Feature
- Small-size VSSOP Packages Save Board Space, or SOIC for Drop-inCompatibility
- Bus I/O Protection
- >±15 kV HBMProtection
- >±12 kV IEC 61000-4-2 ContactDischarge
- >±4 kV IEC 61000-4-4 Fast TransientBurst
- Extended Industrial Temperature Range –40°C to 125°C
- Large Receiver Hysteresis (80 mV) for NoiseRejection
- Low Unit-Loading Allows Over 200 ConnectedNodes
- Low Power Consumption
- Low Standby Supply Current:< 2 μA
- ICC < 1 mA Quiescent DuringOperation
- 5-V Tolerant Logic Inputs Compatible With3.3-V or 5-V Controllers
- Signaling Rate Options Optimized for: 250 kbps, 20 Mbps, 50 Mbps
- Glitch Free Power-Up and Power-Down Bus Inputs and Outputs
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