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The CYP15G0401DXB-BGI is IC TXRX HOTLINK 256LBGA, that includes HOTlink II? Series, they are designed to operate with a Tray Packaging, Package Case is shown on datasheet note for use in a 256-LBGA Exposed Pad, it has an Operating Temperature range of -40°C ~ 85°C, Mounting Type is designed to work in Surface Mount, as well as the LVTTL Interface, the device can also be used as 3.135 V ~ 3.465 V Voltage Supply. In addition, the Supplier Device Package is 256-BGA, the device is offered in 4 Number of Circuits, the device has a 830mA of Current Supply.
The CYP15G0401DXB-BGC is IC TXRX HOTLINK 256LBGA, that includes 3.135 V ~ 3.465 V Voltage Supply, they are designed to operate with a 256-BGA Supplier Device Package, Series is shown on datasheet note for use in a HOTlink II?, that offers Packaging features such as Tray, Package Case is designed to work in 256-LBGA Exposed Pad, it has an Operating Temperature range of 0°C ~ 70°C, the device can also be used as 4 Number of Circuits. In addition, the Mounting Type is Surface Mount, the device is offered in LVTTL Interface, the device has a 830mA of Current Supply.
CYP15G0401DXA-BGC with circuit diagram manufactured by CYPRESS. The CYP15G0401DXA-BGC is available in BGA Package, is part of the IC Chips.
