The AMC1301DWVR parts are IC AMP ISOLATION 250MV 8SOIC,SP Amp ISOL Amp Dual 5.5V 8-Pin SOIC T/R - Tape and Reel, manufactured by TI are available for purchase at 9icnet Electronics. Here you can find various types and values of electronic parts from the world's leading manufacturers. The AMC1301DWVR components of 9icnet Electronics are carefully chosen, undergo stringent quality control, and are successfully meet all required standards.
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AMC12DTMZ with pin details, that includes Tray Packaging, they are designed to operate with a Solder Termination, it has an Operating Temperature range of -65°C ~ 150°C, that offers Mounting Type features such as Through Hole, Right Angle, Contact Material is designed to work in Beryllium Copper, as well as the Gold Contact Finish, the device can also be used as 30μin (0.76μm) Contact Finish Thickness. In addition, the Number of Positions is 24, the device is offered in 0.100" (2.54mm) Pitch, the device has a 2 of Number of Rows, and Gender is Female, and the Contact Type is Loop Bellows, and Card Thickness is 0.062" (1.57mm), and the Flange Feature is Flush Mount, Side Opening, Unthreaded, 0.125" (3.18mm) Dia, and Card Type is Non Specified - Dual Edge, and the Number of Positions Bay Row is 12.
AMC12DTMZ-S273 with user guide, that includes Solder Termination, they are designed to operate with a 0.100" (2.54mm) Pitch, Packaging is shown on datasheet note for use in a Tray, it has an Operating Temperature range of -65°C ~ 150°C, Number of Rows is designed to work in 2, as well as the 12 Number of Positions Bay Row, the device can also be used as 24 Number of Positions. In addition, the Mounting Type is Through Hole, Right Angle, the device is offered in Female Gender, the device has a Flush Mount, Side Opening, Unthreaded, 0.125" (3.18mm) Dia of Flange Feature, and Contact Type is Loop Bellows, and the Contact Material is Beryllium Copper, and Contact Finish Thickness is 30μin (0.76μm), and the Contact Finish is Gold, and Card Type is Non Specified - Dual Edge, and the Card Thickness is 0.093" (2.36mm).
AMC12DTMZ-S664 with circuit diagram, that includes 0.125" (3.18mm) Card Thickness, they are designed to operate with a Non Specified - Dual Edge Card Type, Contact Finish is shown on datasheet note for use in a Gold, that offers Contact Finish Thickness features such as 30μin (0.76μm), Contact Material is designed to work in Beryllium Copper, as well as the Loop Bellows Contact Type, the device can also be used as Flush Mount, Side Opening, Unthreaded, 0.125" (3.18mm) Dia Flange Feature. In addition, the Gender is Female, the device is offered in Through Hole, Right Angle Mounting Type, the device has a 24 of Number of Positions, and Number of Positions Bay Row is 12, and the Number of Rows is 2, it has an Operating Temperature range of -65°C ~ 150°C, and the Packaging is Tray, and Pitch is 0.100" (2.54mm), and the Termination is Solder.
AMC12DTMT-S664 with EDA / CAD Models, that includes Tray Packaging, they are designed to operate with a Through Hole, Right Angle Mounting Type, Termination is shown on datasheet note for use in a Solder, that offers Card Type features such as Non Specified - Dual Edge, Contact Type is designed to work in Loop Bellows, as well as the Gold Contact Finish, the device can also be used as Flush Mount, Top Opening, Threaded Insert, 4-40 Flange Feature. In addition, the Gender is Female, the device is offered in Beryllium Copper Contact Material, it has an Operating Temperature range of -65°C ~ 150°C, and Contact Finish Thickness is 30μin (0.76μm), and the Number of Positions is 24, and Number of Rows is 2, and the Number of Positions Bay Row is 12, and Card Thickness is 0.125" (3.18mm), and the Pitch is 0.100" (2.54mm).
