*Not Recommended For New Design*The SST39VF3201-70-4I-B3KE device is organized in 2M x16, The split-gate cell design and thick-oxide tunneling injector attain better reliability and manufacturability compared with alternate approaches. The SST39VF3201-70-4I-B3KE writes (Program or Erase) with a 2.7-3.6V power supply. This device conforms to JEDEC standard pinouts for x16 memories.
Please consider this deviceSST39VF3201C
Feature
- Organized as 2M x16: SST39VF3201/3202
- Low Power Consumption (typical values at 5 MHz)– Active Current: 9 mA (typical)– Standby Current: 3 µA (typical)– Auto Low Power Mode: 3 µA (typical)
- Hardware Block-Protection/WP# Input Pin– Top Block-Protection (top 32 KWord)for SST39VF3202– Bottom Block-Protection (bottom 32 KWord)for SST39VF3201
- Sector-Erase Capability– Uniform 2 KWord sectors
- Block-Erase Capability– Uniform 32 KWord blocks
- Chip-Erase Capability
- Erase-Suspend/Erase-Resume Capabilities
- Hardware Reset Pin (RST#)
- Security-ID Feature– SST: 128 bits; User: 128 bits
- Fast Erase and Word-Program:– Sector-Erase Time: 18 ms (typical)– Block-Erase Time: 18 ms (typical)– Chip-Erase Time: 40 ms (typical)– Word-Program Time: 7 µs (typical)
- Packages Available– 48-lead TSOP (12mm x 20mm)– 48-ball TFBGA (6mm x 8mm)
- All non-Pb (lead-free) devices are RoHS compliant
