The Microchip AT28HC256is a high-performance 256Kbit Parallel EEPROM available in both Industrial andMilitary temp ranges, offering access times to 70ns with power dissipation of440mW. Deselected, CMOS standby current is less than 5mA. Accessed like staticRAM for the read or write cycle without external components, it contains a64-byte page register to allow writing of up to 64 bytes simultaneously. Featuresan internal Error Correction Circuit forextended endurance and improved data retention, in Military version. Optional Software Data Protection mechanism guardsagainst inadvertent writes; and an extra 64 bytes of EEPROM enables deviceidentification or tracking.
The AT28HC256F-90SU-T is also available DUAL MARKED where applicable with the appropriate Standard Military Drawing Number - 5962-886340xxx. See the datasheet for exact MIL product availability.
Feature
- 32 Kbits x 8 (256 Kbit)
- 5V ± 10% Supply
- Parallel Interface
- AT28HC256E - High Endurance 100K Write Cycles Option
- AT28HC256F - 3 ms Fast Write Option
- 70ns access time
- Self-Timed Erase and Write Cycles (10 ms max)
- Page Write and Byte Write
- Data Polling for end of write detection
- Low Power Consumption
- Read / Write current 80 mA (Max)
- Standby current TTL 3 mA (Max), CMOS 300 μA (Max)
- Write-Protection
- Hardware Protection
- Software Data Protect
- Data retention > 10 years
- Temperature Ranges
- Standard Temperature Range: -40°C to 85°C
- Military Temperature Range: -55°C to 125°C
- Available in Green (Pb/Halide-free) Packaging
- 32-lead, Plastic J-leaded Chip Carrier (PLCC)
- 28-lead, 0.300" Wide, Plastic Gull Wing Small Outline (SOIC)
- 28-lead, Plastic Thin Small Outline Package (TSOP)
- Available in Dual marked (5962-886340xxx) CERAMIC Hermetic Packaging
- 28-Lead, 0.600" Wide, Non-Windowed, Ceramic Dual Inline (Cerdip)
- 28-Lead, Non-Windowed, Ceramic Bottom-Brazed Flat Package (Flatpack)
- 32-Pad, Non-windowed, Ceramic, Leadless Chip Carrier (LCC)
