The SST26VF016B/032B/064B family of devices from Microchip are Serial Quad I/O™ (SQI™) interface SuperFlash® memory ICs featuring a six-wire, 4-bit I/O interface that allow for low power, high performance operation in a compact low pin-count package. The use of Microchip’s SQI™ interface results in performance of up to 104 MHz and enables low-latency execute-in-place (XIP) capability with minimal processor buffer memory. These flash memory chips also support full command-set compatibility to traditional Serial Peripheral Interface (SPI) protocol.
Through the use of SuperFlash® technology these devices offer exceptional erase times that compare very favourably to other Flash memory alternatives. Sector and block erase commands are typically completed in 18 ms, full chip erase operation taking a typical 35 ms.
Serial Interface Architecture – Nibble-Wide Multiplexed I/O’s with SPI-like Serial Command Structure
x1/x2/x4 Serial Peripheral Interface (SPI) Protocol
High Speed Clock Frequency- 104 MHz Max
Burst Modes
Low Power Consumption – Active Read 15 mA (Typical at 104 MHz), Standby 15 μA (Typical)
Fast Erase Time - Sector/Block Erase: 18 ms (Typical); Chip Erase 35 ms (Typical)
Flexible Erase Capability
Software Write Protection
Feature
Serial Interface Architecture- Nibble-wide multiplexed I/O’s with SPI-like serial command structure: Mode 0 and Mode 3
x1/x2/x4 Serial Peripheral Interface (SPI) Protocol and SQI protocol
Burst Modes- Continuous linear burst, 8/16/32/64 Byte linear burst with wrap-around
Page-Program- 256 Bytes per page in x1 or x4 mode
Flexible Erase Capability- Uniform 4 KByte sectors, Four 8 KByte top and bottom parameter overlay blocks, One 32 KByte top and bottom overlay block, Uniform 64 KByte overlay blocks
Software Write Protection- Individual Block-Locking: 64 KByte blocks, two 32 KByte blocks, and eight 8 KByte parameter blocks
Low Power Consumption: Active Read current: 15 mA (typical @ 104 MHz), Standby Current: 15 µA (typical)
- Serial Flash Discoverable Parameters (SFDP)
Temperature options:
Industrial -40ºC to +85ºC and Extended -40ºC to +105ºC
Packages Available: 8-contact WDFN (6mm x 5mm), 8-lead SOIC (208 mil), 16-lead SOIC (300 mil), 24-ball TBGA (6mm x 8mm)
All devices are RoHS compliant
Automotive Grade 2 and 3 available
