All trademarks are the property of their respective owners.
DescriptionThe LM5111-1M/NOPB Dual Gate Driver replaces industry standard gate drivers with improved peakoutput current and efficiency. Each compound output driver stageincludes MOS and bipolar transistors operating in parallel that together sink more than 5-A peakfrom capacitive loads. Combining the unique characteristics of MOS and bipolar devices reducesdrive current variation with voltage and temperature. Undervoltage lockout protection is alsoprovided. The drivers can be operated in parallel with inputs and outputs connected to double thedrive current capability. This device is available in the SOIC package or the thermally enhancedMSOP-PowerPAD package.
Feature
- Independently Drives Two N-Channel MOSFETs
- CompoundCMOS and Bipolar Outputs Reduce Output Current Variation
- 5-A Sink and 3-ASource Current Capability
- Two Channels can be Connected in Parallel to Doublethe Drive Current
- Independent Inputs (TTL Compatible)
- FastPropagation Times (25 ns Typical)
- Fast Rise and Fall Times (14 ns and 12 nsRise and Fall, Respectively, With 2-nF Load)
- Available in Dual Noninverting,Dual Inverting and Combination Configurations
- Supply Rail Undervoltage LockoutProtection (UVLO)?
- LM5111-4 UVLO Configured to Drive PFET through OUT_A andNFET through OUT_B
- Pin Compatible With Industry Standard GateDrivers
All trademarks are the property of their respective owners.
DescriptionThe LM5111 Dual Gate Driver replaces industry standard gate drivers with improved peakoutput current and efficiency. Each compound output driver stageincludes MOS and bipolar transistors operating in parallel that together sink more than 5-A peakfrom capacitive loads. Combining the unique characteristics of MOS and bipolar devices reducesdrive current variation with voltage and temperature. Undervoltage lockout protection is alsoprovided. The drivers can be operated in parallel with inputs and outputs connected to double thedrive current capability. This device is available in the SOIC package or the thermally enhancedMSOP-PowerPAD package.
