The SN74LVC1G99DCTT device is operational from 1.65 V to 5.5 V.
The SN74LVC1G99DCTT device features configurable multiple functions with a 3-state output. The output is disabled when the output-enable (OE should be tied to VCC through a pullup resistor; the minimum value of the resistor is determined by the current-sinking capability of the driver.
This device is fully specified for partial-power-down applications using Ioff. The Ioff circuitry disables the outputs, preventing damaging current backflow through the device when it is powered down.
NanoFree? package technologies are a major breakthrough in IC packaging concepts, using the die as the package.
Feature
- Available in Texas InstrumentsNanoFree Package
- Supports 5-V VCC Operation
- Inputs Accept Voltages to 5.5 V
- Supports Down Translation to VCC
- Max tpd of 6.7 ns at 3.3 V
- Low Power Consumption, 10-μA Max ICC
- ±24-mA Output Drive at 3.3 V
- Offers Nine Different Logic Functions in a Single Package
- Ioff Supports Live Insertion, Partial-Power-Down Mode, and Back-Drive Protection
- Input Hysteresis Allows for Slow Input Transition Time and Better Noise Immunity at Input
- Latch-Up Performance Exceeds 100 mA PerJESD 78, Class II
- ESD Protection Exceeds JESD 22
- 2000-V Human-Body Model (A114-A)
- 200-V Machine Model (A115-A)
- 1000-V Charged-Device Model (C101)
The SN74LVC1G99 device is operational from 1.65 V to 5.5 V.
The SN74LVC1G99 device features configurable multiple functions with a 3-state output. The output is disabled when the output-enable (OE should be tied to VCC through a pullup resistor; the minimum value of the resistor is determined by the current-sinking capability of the driver.
This device is fully specified for partial-power-down applications using Ioff. The Ioff circuitry disables the outputs, preventing damaging current backflow through the device when it is powered down.
NanoFree? package technologies are a major breakthrough in IC packaging concepts, using the die as the package.
