DESCRIPTION
The SN74LVC1G10DBVR performs the Boolean function Y=A·B·C =A+B+C in positive logic.
NanoFreeM package technology is a major breakthrough in IC packaging concepts, using the die as the package.
This device is fully specified for partial-power-downapplications using lof. The lof circuitry disables the outputs, preventing damaging current backflow through the device when it is powered down.
FEATURES
· Available in the Texas Instruments NanoFree TM Package
· Supports 5-V Vcc Operation
· Inputs Accept Voltages to 5.5V
· Provides Down Translation to Vcc
· Max tod of 3.8ns at 3.3V
· Low Power Consumption,10-uA Max lcc
·±24-mA Output Drive at3.3V
· loff Supports Live Insertion, Partial-Power-Down Mode, and Back Drive Protection
· Latch-Up Performance Exceeds 100 mA per JESD78, Class ll
· ESD Protection Exceeds JESD 22
-2000-V Human-Body Model(A114-A)
-200-V Machine Model(A115-A)
-1000-V Charged Device Model(C101)
Feature
- Available in the Texas Instruments NanoFree Package
- Supports 5-V VCC Operation
- Inputs Accept Voltages to 5.5 V
- Provides Down Translation to VCC
- Max tpd of 3.8 ns at 3.3 V
- Low Power Consumption, 10-μA Max ICC
- ±24-mA Output Drive at 3.3 V
- Ioff Supports Live Insertion, Partial-Power-Down Mode, and Back Drive Protection
- Latch-Up Performance Exceeds 100 mA per JESD 78, Class II
- ESD Protection Exceeds JESD 22
- 2000-V Human-Body Model (A114-A)
- 200-V Machine Model (A115-A)
- 1000-V Charged Device Model (C101)
The SN74LVC1G10 performs the Boolean function Y = C in positive logic.
NanoFree? package technology is a major breakthrough in IC packaging concepts, using the die as the package.
This device is fully specified for partial-power-down applications using Ioff. The Ioff circuitry disables the outputs, preventing damaging current backflow through the device when it is powered down.
(Picture:Pinout / Diagram)
