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BCM56873A0KFSBG
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BCM56873A0KFSBG

  • 描述:2.0T 20X100GBE MULTILAYER SWITCH
  • 品牌: 博通 (Broadcom)
  • 交期:5-7 工作日
渠道:
  • 自营
  • 得捷
  • 贸泽

起订量: 84

数量 单价 合计
84+ 20690.06814 1737965.72376
  • 库存: 0
  • 单价: ¥20,690.06814
  • 数量:
    - +
  • 总计: ¥1,737,965.72
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规格参数

  • 部件状态 可供货
  • 种类 -
  • 集成电路 -
  • 独立电路板 -
  • 输出高电流, 输出低电流 -
  • 电压供应源 -
  • 电源电压 -
  • 工作温度 -
  • 安装类别 -
  • 包装/外壳 -
  • 供应商设备包装 -
  • 制造厂商 博通 (Broadcom)

BCM56873A0KFSBG 产品详情

Server interfaces in the enterprise and service provider data centers are starting to transition from 10 to 25GbE. At the same time SDN is taking hold in these market segments, bringing with it many new requirements such as noveloverlays, instrumentation and telemetry. Trident 3introduces dataplane programmability and 25 Gbps SerDesinto the industry-leading Trident™ line to address these evolving markets.With support for up to 32 ports of 100GbE, the StrataXGS® Trident 3switch series can be used to build highly scalable, low-power, feature-rich Top-of-Rack (ToR), Aggregation and Spine switches. The programmable pipeline allows new features to be added after deployment by means of in-field upgrade, providing capex investment protection for operators. Trident 3 programmability enables the latest, cloud-scaleinstrumentation and telemetry features, for example in-band telemetry. Trident 3 programmability can also be used to add new software-defined forwardingand database reconfiguration features.In addition, fabrics of BCM56870devices can be interconnected via the HiGig2™ protocol to support multi-terabit chassis designs for large-scale data center, enterprise and service provider applications. The StrataXGS Trident 3 switch with integrated FleXGS™ Programmability technology has been designed to address performance, capacity and service requirements for next-generation data centers and cloud computing applications.

Feature

  • Fully programmable dataplane allows introduction of new features via in-field upgrade
  • Support for new overlays and tunneling such as GENEVE, NSH, VXLAN, GPE, MPLS, MPLS over GRE/UDP,GUE, ILA and PPPoE
  • Up to 128x 25G integrated SerDes with CL 74, CL 91and CL 108 FEC
  • New instrumentation features such as timestamping, trace captures and Inband Telemetry
  • 32MB of on-chip fully shared packet buffer
  • Dynamic Load Balancing enhances ECMP
  • Large, programmable on-chip forwarding databases for L2 switching, L3 routing, label switching, and overlay forwarding
  • 3X increased ACL scale to support evolving policy/security requirements
  • PCIe Gen3 x4 host CPU interface with on-chip accelerators improves control-plane update and boot performance by up to 5X
  • Programmable support for enhanced network telemetry, including per-packet timestamping, Flow Tracker, microburst detection, latency/drop monitor, Active-probe-based in-band network telemetry, and in-band OAM processing; integrated with open-source BroadView v2 telemetry agent and analytics software
  • Adaptive Routing for dynamic traffic engineering in non-Clostopologies
  • Full feature compatibility with previous generation Trident 2 and Trident 2+ devices

Applications

  • Single-chip solution for data center Top-of-Rack, Aggregation and Spine Switches
  • Data center Fixed and Chassis/Modular switches
  • Enterprise aggregation and converged core
  • Data Center Interconnect (DCI)
  • Software-Defined Networking Solutions
BCM56873A0KFSBG所属分类:信号开关/多路复用器/解码器,BCM56873A0KFSBG 由 博通 (Broadcom) 设计生产,可通过久芯网进行购买。BCM56873A0KFSBG价格参考¥20690.068140,你可以下载 BCM56873A0KFSBG中文资料、PDF数据手册、Datasheet数据手册功能说明书,可查询BCM56873A0KFSBG规格参数、现货库存、封装信息等信息!

博通 (Broadcom)

博通 (Broadcom)

博通是一家多元化的全球半导体领导者,建立在50年的创新、合作和卓越工程的基础上。博通广泛的产品组合服务于四个主要终端市场的多种应用:有线基础设施、无线通信、企业存储和工业及其他。我们的产品在这些终端市场...

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