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AS4C8M16D1A-5TINTR with pin details, that includes DDR1 Type, they are designed to operate with a Tape & Reel (TR) Alternate Packaging Packaging, Mounting Style is shown on datasheet note for use in a SMD/SMT, that offers Package Case features such as 66-TSSOP (0.400", 10.16mm Width), it has an Operating Temperature range of -40°C ~ 85°C (TA), as well as the Parallel Interface, the device can also be used as 2.3 V ~ 2.7 V Voltage Supply. In addition, the Supplier Device Package is 66-TSOP II, the device is offered in 128M (8M x 16) Memory Size, the device has a DDR SDRAM of Memory Type, and Speed is 200MHz, and the Format Memory is RAM, it has an Maximum Operating Temperature range of + 85 C, it has an Minimum Operating Temperature range of - 40 C, and Organization is 8 M x 16, and the Supply Voltage Max is 2.7 V, and Supply Voltage Min is 2.3 V, and the Maximum Clock Frequency is 200 MHz.
AS4C8M16S-6BINTR with user guide, that includes 3 V ~ 3.6 V Voltage Supply, they are designed to operate with a 54-TFBGA (8x8) Supplier Device Package, Speed is shown on datasheet note for use in a 166MHz, that offers Packaging features such as Tape & Reel (TR) Alternate Packaging, Package Case is designed to work in 54-TFBGA, it has an Operating Temperature range of -40°C ~ 85°C (TA), the device can also be used as SDRAM Memory Type. In addition, the Memory Size is 128M (8M x 16), the device is offered in Parallel Interface, the device has a RAM of Format Memory.
AS4C8M16S-6BIN with circuit diagram, that includes RAM Format Memory, they are designed to operate with a Parallel Interface, Memory Size is shown on datasheet note for use in a 128M (8M x 16), that offers Memory Type features such as SDRAM, it has an Operating Temperature range of -40°C ~ 85°C (TA), as well as the 54-TFBGA Package Case, the device can also be used as Tray Packaging. In addition, the Speed is 166MHz, the device is offered in 54-TFBGA (8x8) Supplier Device Package, the device has a 3 V ~ 3.6 V of Voltage Supply.