The SN74SSTL16857DGGR parts manufactured by TI are available for purchase at 9icnet Electronics. Here you can find various types and values of electronic parts from the world's leading manufacturers. The SN74SSTL16857DGGR components of 9icnet Electronics are carefully chosen, undergo stringent quality control, and are successfully meet all required standards.
The production status marked on 9icnet.com is for reference only. If you didn't find what you were looking for, you can get more valuable information by emails, such as the SN74SSTL16857DGGR Inventory quantity, preferential price, datasheet, and manufacturer. We are always happy to hear from you, so feel free to contact us.
The SN74SSTL16847DGGR is IC BUFF TRI-STATE N-INV 64TSSOP, that includes 74SSTL Series, they are designed to operate with a Digi-ReelR Packaging, Package Case is shown on datasheet note for use in a 64-TFSOP (0.240", 6.10mm Width), it has an Operating Temperature range of 0°C ~ 70°C, Mounting Type is designed to work in Surface Mount, as well as the 3 V ~ 3.6 V Voltage Supply, the device can also be used as 64-TSSOP Supplier Device Package. In addition, the Number of Elements is 1, the device is offered in 20mA, 20mA Current Output High Low, the device has a Buffer/Line Driver, Non-Inverting of Logic Type, and Number of Bits per Element is 20.
The SN74SSTL16837ADGGR is IC UNIV BUS DVR 20BIT 64TSSOP, that includes 3 V ~ 3.6 V Voltage Supply, they are designed to operate with a 64-TSSOP Supplier Device Package, Series is shown on datasheet note for use in a 74SSTL, that offers Packaging features such as Digi-ReelR, Package Case is designed to work in 64-TFSOP (0.240", 6.10mm Width), it has an Operating Temperature range of 0°C ~ 70°C, the device can also be used as 20-Bit Number of Circuits. In addition, the Mounting Type is Surface Mount, the device is offered in Universal Bus Driver Logic Type, the device has a 20mA, 20mA of Current Output High Low.
SN74SSTL16837DGGR with circuit diagram manufactured by TI. The SN74SSTL16837DGGR is available in TSOP Package, is part of the IC Chips.