The Microchip AT28C256E-15DM/883-815 is a high-performance256Kbit Parallel EEPROM available in both Industrial and Military temp ranges, offeringaccess times to 150ns with power dissipation of 440mW. Deselected, CMOS standbycurrent is less than 200μA. Accessedlike static RAM for the read or write cycle without external components, itcontains a 64-byte page register to allow writing of up to 64bytessimultaneously. Features an internal ErrorCorrection Circuit for extended endurance and improved data retention, inMilitary version. Optional Software DataProtection mechanism guards against inadvertent writes; and an extra 64bytes of EEPROM enables device identification or tracking.
The AT28C256E-15DM/883-815 is also available DUAL MARKED where applicable with the appropriate Standard Military Drawing Number - 5962-88525xxxx. See the datasheet for exact MIL product availability.
Feature
- 32 Kbits x 8 (256 Kbit)
- 5V ± 10% Supply
- Parallel Interface
- AT28C256E - High Endurance 100K Write Cycles Option
- AT28C256F - 3 ms Fast Write Option
- 150ns access time
- Self-Timed Erase and Write Cycles (10 ms max)
- Page Write and Byte Write
- Data Polling for end of write detection
- Available in Green (Pb/Halide-free) Packaging
- Low Power Consumption
- Read / Write current 40 mA (Max)
- 32-lead, Plastic J-leaded Chip Carrier (PLCC)
- Standby current TTL 2 mA (Max), CMOS 200 μA (Max)
- Write-Protection
- Hardware Protection
- Software Data Protect
- Data retention > 10 years
- Temperature Ranges
- Standard Temperature Range: -40°C to 85°C
- Military Temperature Range: -55°C to 125°C
- 28-lead, 0.600" Wide, Plastic Dual Inline Package (PDIP)
- 28-lead, 0.300" Wide, Plastic Gull Wing Small Outline (SOIC)
- 28-lead, Plastic Thin Small Outline Package (TSOP)
- Available in SMD Dual marked (5962-88525xxxx) CERAMIC Hermetic Packaging
- 28-Lead, 0.600" Wide, Non-Windowed, Ceramic Dual Inline (Cerdip)
- 28-Lead, Non-Windowed, Ceramic Bottom-Brazed Flat Package (Flatpack)
- 32-Pad, Non-windowed, Ceramic, Leadless Chip Carrier (LCC)
