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S26KL128SDABHI030 with pin details, that includes HyperFlash? KL Series, they are designed to operate with a Tray Packaging, Mounting Style is shown on datasheet note for use in a SMD/SMT, it has an Operating Temperature Range range of - 40 C to + 85 C, Package Case is designed to work in 24-TBGA, it has an Operating Temperature range of -40°C ~ 85°C (TA), the device can also be used as Parallel Interface. In addition, the Voltage Supply is 2.7 V ~ 3.6 V, the device is offered in 24-BGA (6x8) Supplier Device Package, the device has a 128M (16M x 8) of Memory Size, and Memory Type is FLASH - NOR, and the Speed is 100MHz, and Architecture is MirrorBit Eclipse, and the Format Memory is FLASH, and Standard is Common Flash Interface (CFI), and the Interface Type is Parallel, and Organization is 16 M x 8, and the Supply Current Max is 180 mA, and Data Bus Width is 8 bit, and the Supply Voltage Max is 3.6 V, and Supply Voltage Min is 2.7 V, and the Maximum Clock Frequency is 100 MHz, and Timing Type is Synchronous.
The S26KL128SDABHI020 is IC HYPERFLASH 3V 128MBIT 24BGA, that includes 2.7 V ~ 3.6 V Voltage Supply, they are designed to operate with a 24-BGA (6x8) Supplier Device Package, Speed is shown on datasheet note for use in a 100MHz, that offers Series features such as HyperFlash? KL, Packaging is designed to work in Tray, as well as the 24-TBGA Package Case, it has an Operating Temperature range of -40°C ~ 85°C (TA). In addition, the Memory Type is FLASH - NOR, the device is offered in 128M (16M x 8) Memory Size, the device has a Parallel of Interface, and Format Memory is FLASH.
The S26D2 is TOOL DIE SET - M10S1 INNER COND, that includes RG-161, 174, 178A, 179, 187, 188, 196 Cable Group, they are designed to operate with a M10S1J Compatible Tools, For Use With Related Products is shown on datasheet note for use in a Coaxial, RF Contacts - Size 16, that offers Series features such as Trim TrioR, Tool Type is designed to work in Die Set.
S26GL256N11FAA02 with EDA / CAD Models is part of the IC Chips.
