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MX30LF4G28AB-TI with pin details, that includes MX30LF Series, they are designed to operate with a Tray Packaging, Package Case is shown on datasheet note for use in a 48-TFSOP (0.724", 18.40mm Width), it has an Operating Temperature range of -40°C ~ 85°C (TA), Interface is designed to work in Parallel, as well as the 2.7 V ~ 3.6 V Voltage Supply, the device can also be used as 48-TSOP Supplier Device Package. In addition, the Memory Size is 4G (512M x 8), the device is offered in FLASH - NAND (SLC) Memory Type, the device has a 20ns of Speed, and Format Memory is FLASH.
MX30UF2G28AB-XKI with user guide, that includes 1.7 V ~ 1.95 V Voltage Supply, they are designed to operate with a 63-VFBGA (9x11) Supplier Device Package, Speed is shown on datasheet note for use in a 25ns, that offers Series features such as MX30UF, Packaging is designed to work in Tray, as well as the 63-VFBGA Package Case, it has an Operating Temperature range of -40°C ~ 85°C (TA). In addition, the Memory Type is FLASH - NAND (SLC), the device is offered in 2G (256M x 8) Memory Size, the device has a Parallel of Interface, and Format Memory is FLASH.
MX30LF4G18AC-XKI with circuit diagram, that includes FLASH Format Memory, they are designed to operate with a Parallel Interface, Memory Size is shown on datasheet note for use in a 4G (512M x 8), that offers Memory Type features such as FLASH - NAND (SLC), it has an Operating Temperature range of -40°C ~ 85°C (TA), as well as the 63-VFBGA Package Case, the device can also be used as Tray Packaging. In addition, the Series is MX30LF, the device is offered in 20ns Speed, the device has a 63-VFBGA (9x11) of Supplier Device Package, and Voltage Supply is 2.7 V ~ 3.6 V.
MX30LF4G28AB-XKI with EDA / CAD Models, that includes Tray Packaging, they are designed to operate with a Parallel Interface, Series is shown on datasheet note for use in a MX30LF, that offers Memory Type features such as FLASH - NAND (SLC), Format Memory is designed to work in FLASH, as well as the 63-VFBGA (9x11) Supplier Device Package, the device can also be used as 63-VFBGA Package Case. In addition, the Memory Size is 4G (512M x 8), it has an Operating Temperature range of -40°C ~ 85°C (TA), the device has a 20ns of Speed, and Voltage Supply is 2.7 V ~ 3.6 V.
