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MX29GL512FDT2I-12G with pin details, that includes MX29GL Series, they are designed to operate with a Tray Packaging, Package Case is shown on datasheet note for use in a 56-TFSOP (0.724", 18.40mm Width), it has an Operating Temperature range of -40°C ~ 85°C (TA), Interface is designed to work in Parallel, as well as the 2.7 V ~ 3.6 V Voltage Supply, the device can also be used as 56-TSOP Supplier Device Package. In addition, the Memory Size is 512M (64M x 8), the device is offered in FLASH - NOR Memory Type, the device has a 120ns of Speed, and Format Memory is FLASH.
MX29GL512FDXFI-11G with user guide, that includes 2.7 V ~ 3.6 V Voltage Supply, they are designed to operate with a 64-LFBGA, CSP (11x13) Supplier Device Package, Speed is shown on datasheet note for use in a 110ns, that offers Series features such as MX29GL, Packaging is designed to work in Tray, as well as the 64-LBGA, CSPBGA Package Case, it has an Operating Temperature range of -40°C ~ 85°C (TA). In addition, the Memory Type is FLASH - NOR, the device is offered in 512M (64M x 8) Memory Size, the device has a Parallel of Interface, and Format Memory is FLASH.
MX29GL512FDXFI-12G with circuit diagram, that includes FLASH Format Memory, they are designed to operate with a Parallel Interface, Memory Size is shown on datasheet note for use in a 512M (64M x 8), that offers Memory Type features such as FLASH - NOR, it has an Operating Temperature range of -40°C ~ 85°C (TA), as well as the 64-LBGA, CSPBGA Package Case, the device can also be used as Tray Packaging. In addition, the Series is MX29GL, the device is offered in 120ns Speed, the device has a 64-LFBGA, CSP (11x13) of Supplier Device Package, and Voltage Supply is 2.7 V ~ 3.6 V.
