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The S29GL256P10FFIS10 is IC FLASH 256MBIT 100NS 64FBGA, that includes GL-P Series, they are designed to operate with a Tray Packaging, Unit Weight is shown on datasheet note for use in a 0.006004 oz, that offers Mounting Style features such as SMD/SMT, it has an Operating Temperature Range range of - 40 C to + 85 C, as well as the 64-LBGA Package Case, it has an Operating Temperature range of -40°C ~ 85°C (TA). In addition, the Interface is Parallel, the device is offered in 2.7 V ~ 3.6 V Voltage Supply, the device has a 64-FBGA (11x13) of Supplier Device Package, and Memory Size is 256M (32M x 8), and the Memory Type is FLASH - NOR, and Speed is 100ns, and the Architecture is Sector, and Format Memory is FLASH, and the Interface Type is Parallel, and Organization is 32 M x 8, and the Supply Current Max is 110 mA, and Data Bus Width is 8 bit, and the Supply Voltage Max is 3.6 V, and Supply Voltage Min is 2.7 V, and the Timing Type is Asynchronous.
S29GL256P10FFIS12 with user guide, that includes 64-Fortified BGA (13x11) Supplier Device Package, they are designed to operate with a 100ns Speed, Series is shown on datasheet note for use in a GL-P, that offers Packaging features such as Tape & Reel (TR) Alternate Packaging, Package Case is designed to work in 64-LBGA, it has an Operating Temperature range of -40°C ~ 85°C (TA), the device can also be used as FLASH - NOR Memory Type. In addition, the Memory Size is 256M (32M x 8), the device is offered in Parallel Interface, the device has a FLASH of Format Memory.
S29GL256P10FFIS13 with circuit diagram, that includes FLASH Format Memory, they are designed to operate with a Parallel Interface, Memory Size is shown on datasheet note for use in a 256M (32M x 8), that offers Memory Type features such as FLASH - NOR, it has an Operating Temperature range of -40°C ~ 85°C (TA), as well as the 64-LBGA Package Case, the device can also be used as Tape & Reel (TR) Alternate Packaging Packaging. In addition, the Series is GL-P, the device is offered in 100ns Speed, the device has a 64-Fortified BGA (13x11) of Supplier Device Package.