Enhanced EcoSmart",Integrated Off-Line Switcher with Advanced Feature Set and Extended Power Range
Product Highlights
Lower System Cost, Higher Design Flexibility
• Multi-mode operation maximizes efficiency at all loads
• New eSIP-7F and eSIP-7C packages
• Low thermal impedance junction-to-case (2 °C per watt)
• Low height is ideal for adapters where space is limited
• Simple mounting using a clip to aid low cost manufacturing
• Horizontal eSIP-7F package ideal for ultra low height adapter and monitor applications
• Extended package creepage distance from DRAIN pin to adjacent pin and to heat sink
• No heat sink required up to 35 W using P, G and M packages with universal input voltage and up to 48 W at 230 VAC
• Output overvoltage protection (OVP) is user programmable for latching/non-latching shutdown with fast AC reset
• Allows both primary and secondary sensing
• Line undervoltage (UV) detection prevents turn-off glitches
• Line overvoltage (OV) shutdown extends line surge limit
• Accurate programmable current limit
• Optimized line feed-forward for line ripple rejection
• 132 kHz frequency (254Y-258Y and all E/L packages) reduces transformer and power supply size
• Half frequency option for video applications
• Frequency jittering reduces EMI filter cost
• Heat sink is connected to SOURCE for low EMI
• Improved auto-restart delivers <3% of maximum power in short circuit and open loop fault conditions
• Accurate hysteretic thermal shutdown function automatically
recovers without requiring a reset
• Fully integrated soft-start for minimum start-up stress
• Extended creepage between DRAIN and all other pins improves field reliability
Description
TOPSwitch-HX cost effectively incorporates a 700 V power
MOSFET, high voltage switched current source, PWM control,
oscillator, thermal shutdown circuit, fault protection and other
control circuitry onto a monolithic device.
Notes for Table 1:
1. Minimum continuous power in a typical non-ventilated enclosed adapter measured at +50 °C ambient. Use of an external heat sink will increase power capability.
2. Minimum continuous power in an open frame design at +50 °C ambient.
3. Peak power capability in any design at +50 °C ambient.
4. 230 VAC or 110/115 VAC with doubler.
5. Packages: P: DIP-8C, G: SMD-8C, M: SDIP-10C,
Y: TO-220-7C, E: eSIP-7C, L: eSIP-7F.See part ordering information.
6. TOP261 and TOP262 have the same current limit set point. In some applications TOP262 may run cooler than TOP261 due to a lower RDS(ON) for the larger device.
(Picture: Pinout)
