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The DS34T101GN+ is IC TDM OVER PACKET 484BGA, that includes DS34T101GN Series, they are designed to operate with a TDM-over-Packets Product, Type is shown on datasheet note for use in a TDM (Time Division Multiplexing), that offers Packaging features such as Tray, Mounting Style is designed to work in SMD/SMT, as well as the 484-BGA Package Case, the device can also be used as Surface Mount Mounting Type. In addition, the Applications is Data Transport, the device is offered in 1 Channel Number of Channels, the device has a 484-TEBGA (23x23) of Supplier Device Package, and Data Rate is 51.84 Mbps, it has an Maximum Operating Temperature range of + 85 C, it has an Minimum Operating Temperature range of - 40 C, and the Operating Supply Voltage is 1.8 V 3.3 V, and Part # Aliases is 90-34T10+1N0.
The DS34S132GNA2+ is IC 32PORT TDM OVER PACKET 676BGA, that includes 1.8V, 3.3V Voltage Supply, they are designed to operate with a 676-PBGA (27x27) Supplier Device Package, Series is shown on datasheet note for use in a DS34S132GNA2, that offers Product features such as TDM-over-Packets, Part # Aliases is designed to work in 90-34S13+2N2, as well as the Tray Packaging, the device can also be used as 676-BGA Package Case, it has an Operating Temperature range of -40°C ~ 85°C, the device is offered in 1 Number of Circuits, the device has a 32 Channel of Number of Channels, and Mounting Type is Surface Mount, and the Interface is TDMoP, and Function is TDM-over-Packet (TDMoP).
The DS34T101GN is IC TDM/PACKET CHIP 484-BGA, that includes Data Transport Applications, they are designed to operate with a Surface Mount Mounting Type, Package Case is shown on datasheet note for use in a 484-BGA, that offers Packaging features such as Tray, Supplier Device Package is designed to work in 484-TEBGA (23x23), as well as the TDM (Time Division Multiplexing) Type.
