9icnet provides you with DIP05-1A72-11D designed and produced by Standex-Meder Electronics, which is sold in 9icnet on the spot, and can be purchased through channels such as the original factory and agents. DIP05-1A72-11D price reference $4.13000. Standex-Meder Electronics DIP05-1A72-11D Package/Specification: RELAY REED SPST 1A 5V. You can download DIP05-1A72-11D english data, pin diagram, Datasheet data sheet function manual, the data contains detailed pin diagrams of diode rectifiers, application circuit diagrams of functions, voltages, usage methods and tutorials.
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DIP050-628-157BLF with pin details, that includes DIP, 0.6" (15.24mm) Row Spacing Type, they are designed to operate with a Tube Packaging, Termination is shown on datasheet note for use in a Solder, that offers Mounting Type features such as Through Hole, Features is designed to work in Open Frame, as well as the Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled Housing Material, the device can also be used as 28 (2 x 14) Number of Positions or Pins Grid. In addition, the Pitch Mating is 0.100" (2.54mm), the device is offered in Tin Contact Finish Mating, the device has a 0.100" (2.54mm) of Pitch Post, and Contact Finish Post is Tin, and the Contact Finish Thickness Mating is 100μin (2.54μm), and Contact Material Mating is Beryllium Copper, and the Contact Finish Thickness Post is 200μin (5.08μm), and Contact Material Post is Brass.
The DIP050-628-160BLF is CONN IC DIP SOCKET 28POS GOLD, that includes DIP, 0.6" (15.24mm) Row Spacing Type, they are designed to operate with a Solder Termination, Pitch Post is shown on datasheet note for use in a 0.100" (2.54mm), that offers Pitch Mating features such as 0.100" (2.54mm), Packaging is designed to work in Tube, as well as the 28 (2 x 14) Number of Positions or Pins Grid, the device can also be used as Through Hole Mounting Type. In addition, the Housing Material is Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled, the device is offered in Open Frame Features, the device has a Brass of Contact Material Post, and Contact Material Mating is Beryllium Copper, and the Contact Finish Thickness Post is 200μin (5.08μm), and Contact Finish Thickness Mating is 30μin (0.76μm), and the Contact Finish Post is Tin, and Contact Finish Mating is Gold.
DIODO SUPRESSOR 1.5KE220A with circuit diagram is part of the IC Chips.
