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The B0322J5050AHF is XFRMR BALUN RF 300-2200MHZ 0805, that includes Series, they are designed to operate with a Baluns Product, Type is shown on datasheet note for use in a Ultral Low Profile Balun, that offers Packaging features such as Digi-ReelR Alternate Packaging, Unit Weight is designed to work in 0.000194 oz, as well as the SMD/SMT Termination Style, the device can also be used as Xinger Tradename. In addition, the Mounting is SMD/SMT, it has an Operating Temperature Range range of - 55 C to + 85 C, the device has a 0805 (2012 Metric) of Package Case, and Impedance is 50 Ohms, and the Mounting Type is Surface Mount, and Frequency Range is 300MHz ~ 2.2GHz, and the Insertion Loss is 1.3 dB, and Impedance Unbalanced Balanced is 50 / 50 Ohm, and the Phase Difference is 17°, and Insertion Loss Max is 1.6dB, and the Return Loss Min is 12.2dB.
The B0310J50100AHF is XFRMR BALUN RF 300-1000MHZ 0805, that includes 0.000194 oz Unit Weight, they are designed to operate with a Ultral Low Profile Balun Type, Tradename is shown on datasheet note for use in a Xinger, that offers Termination Style features such as SMD/SMT, Series is designed to work in , as well as the 8.1dB Return Loss Min, the device can also be used as Baluns Product. In addition, the Phase Difference is 38°, the device is offered in Digi-ReelR Alternate Packaging Packaging, the device has a 0805 (2012 Metric) of Package Case, it has an Operating Temperature Range range of - 55 C to + 85 C, and the Mounting Type is Surface Mount, and Mounting is SMD/SMT, and the Insertion Loss Max is 1.0dB, and Insertion Loss is 1 dB, and the Impedance Unbalanced Balanced is 50 / 100 Ohm, and Impedance is 100 Ohms, and the Frequency Range is 300MHz ~ 1GHz.
B030900 with circuit diagram manufactured by MOTOROLA. The B030900 is available in MODULE Package, is part of the Module.
B031 with EDA / CAD Models manufactured by ASTEC. The B031 is available in SOT23 Package, is part of the IC Chips.
