The HCC15-3-A parts manufactured by POWER-ONE are available for purchase at 9icnet Electronics. Here you can find various types and values of electronic parts from the world's leading manufacturers. The HCC15-3-A components of 9icnet Electronics are carefully chosen, undergo stringent quality control, and are successfully meet all required standards.
The production status marked on 9icnet.com is for reference only. If you didn't find what you were looking for, you can get more valuable information by emails, such as the HCC15-3-A Inventory quantity, preferential price, datasheet, and manufacturer. We are always happy to hear from you, so feel free to contact us.
HCC13HEYS with pin details, that includes Tray Packaging, they are designed to operate with a Solder Termination, it has an Operating Temperature range of -65°C ~ 125°C, that offers Mounting Type features such as Through Hole, Contact Material is designed to work in Beryllium Copper, as well as the Gold Contact Finish, the device can also be used as 30μin (0.76μm) Contact Finish Thickness. In addition, the Number of Positions is 13, the device is offered in 0.100" (2.54mm) Pitch, the device has a 1 of Number of Rows, and Gender is Female, and the Contact Type is Cantilever, and Card Thickness is 0.062" (1.57mm), and the Flange Feature is Side Mount Opening, Unthreaded, 0.125" (3.18mm) Dia, and Card Type is Non Specified - Dual Edge, and the Number of Positions Bay Row is .
HCC13HEYH with user guide, that includes Solder Termination, they are designed to operate with a 0.100" (2.54mm) Pitch, Packaging is shown on datasheet note for use in a Tray, it has an Operating Temperature range of -65°C ~ 125°C, Number of Rows is designed to work in 1, as well as the Number of Positions Bay Row, the device can also be used as 13 Number of Positions. In addition, the Mounting Type is Through Hole, the device is offered in Female Gender, the device has a Top Mount Opening, Unthreaded, 0.125" (3.18mm) Dia of Flange Feature, and Contact Type is Cantilever, and the Contact Material is Beryllium Copper, and Contact Finish Thickness is 30μin (0.76μm), and the Contact Finish is Gold, and Card Type is Non Specified - Dual Edge, and the Card Thickness is 0.062" (1.57mm).
HCC13HEYI with circuit diagram, that includes 0.062" (1.57mm) Card Thickness, they are designed to operate with a Non Specified - Dual Edge Card Type, Contact Finish is shown on datasheet note for use in a Gold, that offers Contact Finish Thickness features such as 30μin (0.76μm), Contact Material is designed to work in Beryllium Copper, as well as the Cantilever Contact Type, the device can also be used as Top Mount Opening, Threaded Insert, 4-40 Flange Feature. In addition, the Gender is Female, the device is offered in Through Hole Mounting Type, the device has a 13 of Number of Positions, and Number of Positions Bay Row is , and the Number of Rows is 1, it has an Operating Temperature range of -65°C ~ 125°C, and the Packaging is Tray, and Pitch is 0.100" (2.54mm), and the Termination is Solder.
HCC13HEYN with EDA / CAD Models, that includes Tray Packaging, they are designed to operate with a Through Hole Mounting Type, Termination is shown on datasheet note for use in a Solder, that offers Card Type features such as Non Specified - Dual Edge, Contact Finish is designed to work in Gold, as well as the Female Gender, the device can also be used as Cantilever Contact Type. In addition, the Contact Material is Beryllium Copper, it has an Operating Temperature range of -65°C ~ 125°C, the device has a 30μin (0.76μm) of Contact Finish Thickness, and Number of Positions is 13, and the Number of Rows is 1, and Pitch is 0.100" (2.54mm), and the Card Thickness is 0.062" (1.57mm), and Number of Positions Bay Row is .
