9icnet provides you with S2-1KF2 designed and produced by Riedon, which is sold in 9icnet on the spot, and can be purchased through channels such as the original factory and agents. S2-1KF2 price reference $0.79668. Riedon S2-1KF2 Package/Specification: RES SMD 1K OHM 1% 1W 2615. You can download S2-1KF2 english data, pin diagram, Datasheet data sheet function manual, the data contains detailed pin diagrams of diode rectifiers, application circuit diagrams of functions, voltages, usage methods and tutorials.
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S2-1K5F1 with pin details, that includes S Series, they are designed to operate with a Digi-ReelR Alternate Packaging Packaging, Height is shown on datasheet note for use in a 0.142" (3.60mm), that offers Package Case features such as 2615 J-Lead, it has an Operating Temperature range of -55°C ~ 275°C, as well as the Flame Proof, Moisture Resistant, Pulse Withstanding, Safety Features, the device can also be used as 0.260" L x 0.154" W (6.60mm x 3.90mm) Size Dimension. In addition, the Supplier Device Package is , the device is offered in 1W Power Watts, the device has a of Resistance Ohms, and Tolerance is ±1%, and the Number of Terminations is 2, and Temperature Coefficient is ±20ppm/°C, and the Composition is Wirewound.
S2-1K5J8 with user guide, that includes ±5% Tolerance, they are designed to operate with a ±20ppm/°C Temperature Coefficient, Supplier Device Package is shown on datasheet note for use in a , that offers Size Dimension features such as 0.260" L x 0.154" W (6.60mm x 3.90mm), Series is designed to work in S, as well as the Resistance Ohms, the device can also be used as 1W Power Watts. In addition, the Packaging is Tape & Reel (TR), the device is offered in 2615 J-Lead Package Case, it has an Operating Temperature range of -55°C ~ 275°C, and Number of Terminations is 2, and the Height is 0.142" (3.60mm), and Features is Flame Proof, Moisture Resistant, Pulse Withstanding, Safety, and the Composition is Wirewound.
S21GHVMC with circuit diagram manufactured by FREESCALE. The S21GHVMC is available in BGA Package, is part of the IC Chips.
