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The 08-820-90C is CONN IC DIP SOCKET 8POS GOLD, that includes Vertisockets? 800 Series, they are designed to operate with a DIP, 0.3" (7.62mm) Row Spacing Type, Packaging is shown on datasheet note for use in a Bulk, that offers Termination features such as Solder, it has an Operating Temperature range of -55°C ~ 105°C, as well as the Through Hole, Right Angle, Horizontal Mounting Type, the device can also be used as Closed Frame Features. In addition, the Housing Material is Polyamide (PA46), Nylon 4/6, Glass Filled, the device is offered in 8 (2 x 4) Number of Positions or Pins Grid, the device has a 0.100" (2.54mm) of Pitch Mating, and Contact Finish Mating is Gold, and the Pitch Post is 0.100" (2.54mm), and Contact Finish Post is Tin, and the Contact Finish Thickness Mating is 30μin (0.76μm), and Contact Material Mating is Beryllium Copper, and the Contact Finish Thickness Post is 200μin (5.08μm), and Contact Material Post is Brass.
The 08-820-90 is CONN IC DIP SOCKET 8POS GOLD, that includes DIP, 0.3" (7.62mm) Row Spacing Type, they are designed to operate with a Solder Termination, Series is shown on datasheet note for use in a Vertisockets? 800, that offers Pitch Post features such as 0.100" (2.54mm), Pitch Mating is designed to work in 0.100" (2.54mm), as well as the Bulk Packaging, the device can also be used as 8 (2 x 4) Number of Positions or Pins Grid. In addition, the Mounting Type is Through Hole, Right Angle, Horizontal, the device is offered in Polyamide (PA46), Nylon 4/6 Housing Material, the device has a Closed Frame of Features, and Contact Material Post is Phosphor Bronze, and the Contact Material Mating is Phosphor Bronze, and Contact Finish Thickness Post is 10μin (0.25μm), and the Contact Finish Thickness Mating is 10μin (0.25μm), and Contact Finish Post is Gold, and the Contact Finish Mating is Gold.
The 08-820-90T is CONN IC DIP SOCKET 8POS TIN, that includes Tin Contact Finish Mating, they are designed to operate with a Tin Contact Finish Post, Contact Finish Thickness Mating is shown on datasheet note for use in a 200μin (5.08μm), that offers Contact Finish Thickness Post features such as 200μin (5.08μm), Contact Material Mating is designed to work in Phosphor Bronze, as well as the Phosphor Bronze Contact Material Post, the device can also be used as Closed Frame Features. In addition, the Housing Material is Polyamide (PA46), Nylon 4/6, the device is offered in Through Hole, Right Angle, Horizontal Mounting Type, the device has a 8 (2 x 4) of Number of Positions or Pins Grid, and Packaging is Bulk, and the Pitch Mating is 0.100" (2.54mm), and Pitch Post is 0.100" (2.54mm), and the Series is Vertisockets? 800, and Termination is Solder, and the Type is DIP, 0.3" (7.62mm) Row Spacing.
The 08-820-90WR is CONN IC DIP SOCKET 8POS GOLD, that includes Vertisockets? 800 Series, they are designed to operate with a Through Hole, Right Angle, Horizontal Mounting Type, Termination is shown on datasheet note for use in a Solder, that offers Housing Material features such as Polyamide (PA46), Nylon 4/6, Contact Material Mating is designed to work in Phosphor Bronze, as well as the Phosphor Bronze Contact Material Post, the device can also be used as Gold Contact Finish Mating. In addition, the Contact Finish Post is Gold, the device is offered in DIP, 0.3" (7.62mm) Row Spacing Type, the device has a Closed Frame of Features, and Packaging is Bulk, and the Number of Positions or Pins Grid is 8 (2 x 4), and Contact Finish Thickness Mating is 10μin (0.25μm), and the Contact Finish Thickness Post is 10μin (0.25μm), and Pitch Mating is 0.100" (2.54mm), and the Pitch Post is 0.100" (2.54mm).
