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The 110-13-314-10-001000 is CONN IC DIP SOCKET 14POS GOLD, that includes 110 Series, they are designed to operate with a DIP, 0.3" (7.62mm) Row Spacing Type, Packaging is shown on datasheet note for use in a Tube, that offers Termination features such as Solder, it has an Operating Temperature range of -55°C ~ 125°C, as well as the Through Hole Mounting Type, the device can also be used as Open Frame Features. In addition, the Housing Material is Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, the device is offered in 14 (2 x 7), 4 Loaded Number of Positions or Pins Grid, the device has a 0.100" (2.54mm) of Pitch Mating, and Contact Finish Mating is Gold, and the Pitch Post is 0.100" (2.54mm), and Contact Finish Post is Gold, and the Contact Finish Thickness Mating is 30μin (0.76μm), and Contact Material Mating is Beryllium Copper, and the Contact Finish Thickness Post is 30μin (0.76μm), and Contact Material Post is Brass Alloy.
The 110-13-314-10-002000 is CONN IC DIP SOCKET 14POS GOLD, that includes DIP, 0.3" (7.62mm) Row Spacing Type, they are designed to operate with a Solder Termination, Series is shown on datasheet note for use in a 110, that offers Pitch Post features such as 0.100" (2.54mm), Pitch Mating is designed to work in 0.100" (2.54mm), as well as the Tube Packaging, it has an Operating Temperature range of -55°C ~ 125°C. In addition, the Number of Positions or Pins Grid is 14 (2 x 7), 8 Loaded, the device is offered in Through Hole Mounting Type, the device has a Polycyclohexylenedimethylene Terephthalate (PCT), Polyester of Housing Material, and Features is Open Frame, and the Contact Material Post is Brass Alloy, and Contact Material Mating is Beryllium Copper, and the Contact Finish Thickness Post is 30μin (0.76μm), and Contact Finish Thickness Mating is 30μin (0.76μm), and the Contact Finish Post is Gold, and Contact Finish Mating is Gold.
The 110-13-310-41-001000 is CONN IC DIP SOCKET 10POS GOLD, that includes Gold Contact Finish Mating, they are designed to operate with a Gold Contact Finish Post, Contact Finish Thickness Mating is shown on datasheet note for use in a 30μin (0.76μm), that offers Contact Finish Thickness Post features such as 10μin (0.25μm), Contact Material Mating is designed to work in Beryllium Copper, as well as the Brass Alloy Contact Material Post, the device can also be used as Open Frame Features. In addition, the Housing Material is Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, the device is offered in Through Hole Mounting Type, the device has a 10 (2 x 5) of Number of Positions or Pins Grid, it has an Operating Temperature range of -55°C ~ 125°C, and the Packaging is Tube, and Pitch Mating is 0.100" (2.54mm), and the Pitch Post is 0.100" (2.54mm), and Series is 110, and the Termination is Solder, and Type is DIP, 0.3" (7.62mm) Row Spacing.
The 110-13-314-41-001000 is CONN IC DIP SOCKET 14POS GOLD, that includes Tube Packaging, they are designed to operate with a Through Hole Mounting Type, Termination is shown on datasheet note for use in a Solder, that offers Housing Material features such as Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Features is designed to work in Open Frame, as well as the Gold Contact Finish Mating, the device can also be used as Gold Contact Finish Post. In addition, the Type is DIP, 0.3" (7.62mm) Row Spacing, the device is offered in Brass Alloy Contact Material Post, the device has a Beryllium Copper of Contact Material Mating, it has an Operating Temperature range of -55°C ~ 125°C, and the Contact Finish Thickness Mating is 30μin (0.76μm), and Number of Positions or Pins Grid is 14 (2 x 7), and the Series is 110, and Contact Finish Thickness Post is 10μin (0.25μm), and the Pitch Mating is 0.100" (2.54mm), and Pitch Post is 0.100" (2.54mm).
