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The 14-823-90TWR is CONN IC DIP SOCKET 14POS TIN, that includes Vertisockets? 800 Series, they are designed to operate with a DIP, 0.3" (7.62mm) Row Spacing Type, Packaging is shown on datasheet note for use in a Bulk, that offers Termination features such as Solder, Mounting Type is designed to work in Through Hole, Right Angle, Horizontal, as well as the Closed Frame Features, the device can also be used as Polyamide (PA46), Nylon 4/6 Housing Material. In addition, the Number of Positions or Pins Grid is 14 (2 x 7), the device is offered in 0.100" (2.54mm) Pitch Mating, the device has a Tin of Contact Finish Mating, and Pitch Post is 0.100" (2.54mm), and the Contact Finish Post is Tin, and Contact Finish Thickness Mating is 200μin (5.08μm), and the Contact Material Mating is Phosphor Bronze, and Contact Finish Thickness Post is 200μin (5.08μm), and the Contact Material Post is Phosphor Bronze.
The 14-823-90WR is CONN IC DIP SOCKET 14POS GOLD, that includes DIP, 0.3" (7.62mm) Row Spacing Type, they are designed to operate with a Solder Termination, Series is shown on datasheet note for use in a Vertisockets? 800, that offers Pitch Post features such as 0.100" (2.54mm), Pitch Mating is designed to work in 0.100" (2.54mm), as well as the Bulk Packaging, the device can also be used as 14 (2 x 7) Number of Positions or Pins Grid. In addition, the Mounting Type is Through Hole, Right Angle, Horizontal, the device is offered in Polyamide (PA46), Nylon 4/6 Housing Material, the device has a Closed Frame of Features, and Contact Material Post is Phosphor Bronze, and the Contact Material Mating is Phosphor Bronze, and Contact Finish Thickness Post is 10μin (0.25μm), and the Contact Finish Thickness Mating is 10μin (0.25μm), and Contact Finish Post is Gold, and the Contact Finish Mating is Gold.
The 14-8240-310C is CONN IC DIP SOCKET 14POS GOLD, that includes Gold Contact Finish Mating, they are designed to operate with a Gold Contact Finish Post, Contact Finish Thickness Mating is shown on datasheet note for use in a 30μin (0.76μm), that offers Contact Finish Thickness Post features such as 10μin (0.25μm), Contact Material Mating is designed to work in Beryllium Copper, as well as the Brass Contact Material Post, the device can also be used as Closed Frame, Elevated Features. In addition, the Housing Material is Polyamide (PA46), Nylon 4/6, Glass Filled, the device is offered in Through Hole Mounting Type, the device has a 14 (2 x 7) of Number of Positions or Pins Grid, it has an Operating Temperature range of -55°C ~ 105°C, and the Packaging is Bulk, and Pitch Mating is 0.100" (2.54mm), and the Pitch Post is 0.100" (2.54mm), and Series is 8, and the Termination is Solder, and Type is DIP, 0.3" (7.62mm) Row Spacing.
1-482416-1 with EDA / CAD Models, more 1-482416-1 informations to contact Tech-supports team please.