The 246555-3 parts manufactured by TE CONNECTIVITY are available for purchase at 9icnet Electronics. Here you can find various types and values of electronic parts from the world's leading manufacturers. The 246555-3 components of 9icnet Electronics are carefully chosen, undergo stringent quality control, and are successfully meet all required standards.
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The 24-6554-18 is CONN IC DIP SOCKET ZIF 24POS, that includes 55 Series, they are designed to operate with a DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing Type, Packaging is shown on datasheet note for use in a Bulk, that offers Termination features such as Solder, it has an Operating Temperature range of -55°C ~ 250°C, as well as the Through Hole Mounting Type, the device can also be used as Closed Frame Features. In addition, the Housing Material is Polyetheretherketone (PEEK), Glass Filled, the device is offered in 24 (2 x 12) Number of Positions or Pins Grid, the device has a 0.100" (2.54mm) of Pitch Mating, and Contact Finish Mating is Nickel Boron, and the Pitch Post is 0.100" (2.54mm), and Contact Finish Post is Nickel Boron, and the Contact Finish Thickness Mating is 50μin (1.27μm), and Contact Material Mating is Beryllium Nickel, and the Contact Finish Thickness Post is 50μin (1.27μm), and Contact Material Post is Beryllium Nickel.
The 24-6554-16 is CONN IC DIP SOCKET ZIF 24POS, that includes DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing Type, they are designed to operate with a Solder Termination, Series is shown on datasheet note for use in a 55, that offers Pitch Post features such as 0.100" (2.54mm), Pitch Mating is designed to work in 0.100" (2.54mm), as well as the Bulk Packaging, the device can also be used as 24 (2 x 12) Number of Positions or Pins Grid. In addition, the Mounting Type is Through Hole, the device is offered in Polyphenylene Sulfide (PPS), Glass Filled Housing Material, the device has a Closed Frame of Features, and Contact Material Post is Beryllium Copper, and the Contact Material Mating is Beryllium Copper, and Contact Finish Thickness Post is 50μin (1.27μm), and the Contact Finish Thickness Mating is 50μin (1.27μm), and Contact Finish Post is Nickel Boron, and the Contact Finish Mating is Nickel Boron.
The 24-6554-11 is CONN IC DIP SOCKET ZIF 24POS GLD, that includes Gold Contact Finish Mating, they are designed to operate with a Gold Contact Finish Post, Contact Material Mating is shown on datasheet note for use in a Beryllium Copper, that offers Contact Material Post features such as Beryllium Copper, Features is designed to work in Closed Frame, as well as the Polyphenylene Sulfide (PPS), Glass Filled Housing Material, the device can also be used as Through Hole Mounting Type. In addition, the Number of Positions or Pins Grid is 24 (2 x 12), the device is offered in Bulk Packaging, the device has a 0.100" (2.54mm) of Pitch Mating, and Pitch Post is 0.100" (2.54mm), and the Series is 55, and Termination is Solder, and the Type is DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing.
