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The 40-822-90C is CONN IC DIP SOCKET 40POS GOLD, that includes Vertisockets? 800 Series, they are designed to operate with a DIP, 0.3" (7.62mm) Row Spacing Type, Packaging is shown on datasheet note for use in a Bulk, that offers Termination features such as Solder, it has an Operating Temperature range of -55°C ~ 105°C, as well as the Through Hole, Right Angle, Horizontal Mounting Type, the device can also be used as Closed Frame Features. In addition, the Housing Material is Polyamide (PA46), Nylon 4/6, Glass Filled, the device is offered in 40 (2 x 20) Number of Positions or Pins Grid, the device has a 0.100" (2.54mm) of Pitch Mating, and Contact Finish Mating is Gold, and the Pitch Post is 0.100" (2.54mm), and Contact Finish Post is Tin, and the Contact Finish Thickness Mating is 30μin (0.76μm), and Contact Material Mating is Beryllium Copper, and the Contact Finish Thickness Post is 200μin (5.08μm), and Contact Material Post is Brass.
The 40-823-90C is CONN IC DIP SOCKET 40POS GOLD, that includes DIP, 0.3" (7.62mm) Row Spacing Type, they are designed to operate with a Solder Termination, Series is shown on datasheet note for use in a Vertisockets? 800, that offers Pitch Post features such as 0.100" (2.54mm), Pitch Mating is designed to work in 0.100" (2.54mm), as well as the Bulk Packaging, it has an Operating Temperature range of -55°C ~ 105°C. In addition, the Number of Positions or Pins Grid is 40 (2 x 20), the device is offered in Through Hole, Right Angle, Horizontal Mounting Type, the device has a Polyamide (PA46), Nylon 4/6, Glass Filled of Housing Material, and Features is Closed Frame, and the Contact Material Post is Brass, and Contact Material Mating is Beryllium Copper, and the Contact Finish Thickness Post is 200μin (5.08μm), and Contact Finish Thickness Mating is 30μin (0.76μm), and the Contact Finish Post is Tin, and Contact Finish Mating is Gold.
40820R-LF1 with circuit diagram manufactured by WE. The 40820R-LF1 is available in SMD Package, is part of the IC Chips.
