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The JW-23-04-T-S-450-250 is CONN STACKER .156" 23POS SGL TIN, that includes Black Color, they are designed to operate with a JW Series, Packaging is shown on datasheet note for use in a Bulk, that offers Termination features such as Solder, Mounting Type is designed to work in Through Hole, as well as the 23 Number of Positions, the device can also be used as 0.156" (3.96mm) Pitch. In addition, the Number of Rows is 1, the device is offered in 0.990" (25.15mm) Length Overall, the device has a 0.250" (6.35mm) of Length Post Mating, and Length Stack Height is 0.450" (11.43mm), and the Length Tail is 0.090" (2.29mm), and Contact Finish Post Mating is Tin.
The JW-24-04-T-S-450-250 is CONN STACKER .156" 24POS SGL TIN, that includes Solder Termination, they are designed to operate with a JW Series, Pitch is shown on datasheet note for use in a 0.156" (3.96mm), that offers Packaging features such as Bulk, Number of Rows is designed to work in 1, as well as the 24 Number of Positions, the device can also be used as Through Hole Mounting Type. In addition, the Length Tail is 0.090" (2.29mm), the device is offered in 0.450" (11.43mm) Length Stack Height, the device has a 0.250" (6.35mm) of Length Post Mating, and Length Overall is 0.990" (25.15mm), and the Contact Finish Post Mating is Tin, and Color is Black.
The JW-24-04-T-S-250-250 is CONN STACKER .156" 24POS SGL TIN, that includes Black Color, they are designed to operate with a Tin Contact Finish Post Mating, Length Overall is shown on datasheet note for use in a 0.590" (14.99mm), that offers Length Post Mating features such as 0.250" (6.35mm), Length Stack Height is designed to work in 0.250" (6.35mm), as well as the 0.090" (2.29mm) Length Tail, the device can also be used as Through Hole Mounting Type. In addition, the Number of Positions is 24, the device is offered in 1 Number of Rows, the device has a Bulk of Packaging, and Pitch is 0.156" (3.96mm), and the Series is JW, and Termination is Solder.
JW246 with EDA / CAD Models manufactured by MIRCON. The JW246 is available in BGA Package, is part of the IC Chips.
