9icnet provides you with HB1400MFZRE designed and produced by TE Connectivity Passive Product, which is sold in 9icnet on the spot, and can be purchased through channels such as the original factory and agents. HB1400MFZRE price reference $4.64298. TE Connectivity Passive Product HB1400MFZRE Package/Specification: RES 400M OHM 1% 1W RADIAL. You can download HB1400MFZRE english data, pin diagram, Datasheet data sheet function manual, the data contains detailed pin diagrams of diode rectifiers, application circuit diagrams of functions, voltages, usage methods and tutorials.
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The HB13M3CZRE is RES 3.3M OHM 2W 0.25% RADIAL, that includes HB, CGS Series, they are designed to operate with a Bulk Packaging, Height is shown on datasheet note for use in a 0.409" (10.40mm), that offers Package Case features such as Radial, it has an Operating Temperature range of -55°C ~ 125°C, as well as the High Voltage Features, the device can also be used as 1.043" L x 0.118" W (26.50mm x 3.00mm) Size Dimension. In addition, the Supplier Device Package is Radial Lead, the device is offered in 2W Power Watts, the device has a of Resistance Ohms, and Tolerance is ±0.25%, and the Number of Terminations is 2, and Temperature Coefficient is ±100ppm/°C, and the Composition is Thick Film.
The HB13M0FZRE is RES 3.00M OHM 2W 1% RADIAL, that includes ±1% Tolerance, they are designed to operate with a ±100ppm/°C Temperature Coefficient, Supplier Device Package is shown on datasheet note for use in a Radial Lead, that offers Size Dimension features such as 1.043" L x 0.118" W (26.50mm x 3.00mm), Series is designed to work in HB, CGS, as well as the 3M Resistance Ohms, the device can also be used as 2W Power Watts. In addition, the Packaging is Bulk, the device is offered in Radial Package Case, it has an Operating Temperature range of -55°C ~ 125°C, and Number of Terminations is 2, and the Height is 0.409" (10.40mm), and Features is High Voltage, and the Composition is Thick Film.
HB14 with circuit diagram manufactured by TI. The HB14 is available in TSSOP-14 Package, is part of the IC Chips.
