9icnet provides you with BMP.753P designed and produced by Banner Engineering Corporation, which is sold in 9icnet on the spot, and can be purchased through channels such as the original factory and agents. BMP.753P price reference $144.00000. Banner Engineering Corporation BMP.753P Package/Specification: GLASS FIBER; DIFFUSE MODE 1.17 M. You can download BMP.753P english data, pin diagram, Datasheet data sheet function manual, the data contains detailed pin diagrams of diode rectifiers, application circuit diagrams of functions, voltages, usage methods and tutorials.
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The 04-7482-10 is CONN SOCKET SIP 4POS TIN, that includes 700 Elevator Strip-Line? Series, they are designed to operate with a SIP Type, Packaging is shown on datasheet note for use in a Bulk, that offers Termination features such as Solder, it has an Operating Temperature range of -55°C ~ 105°C, as well as the Through Hole Mounting Type, the device can also be used as Elevated Features. In addition, the Housing Material is Polyamide (PA46), Nylon 4/6, Glass Filled, the device is offered in 4 (1 x 4) Number of Positions or Pins Grid, the device has a 0.100" (2.54mm) of Pitch Mating, and Contact Finish Mating is Tin, and the Pitch Post is 0.100" (2.54mm), and Contact Finish Post is Tin, and the Contact Finish Thickness Mating is 200μin (5.08μm), and Contact Material Mating is Phosphor Bronze, and the Contact Finish Thickness Post is 200μin (5.08μm), and Contact Material Post is Phosphor Bronze.
The 04-7500-10 is CONN SOCKET SIP 4POS TIN, that includes SIP Type, they are designed to operate with a Solder Termination, Series is shown on datasheet note for use in a 700 Elevator Strip-Line?, that offers Pitch Post features such as 0.100" (2.54mm), Pitch Mating is designed to work in 0.100" (2.54mm), as well as the Bulk Packaging, it has an Operating Temperature range of -55°C ~ 105°C. In addition, the Number of Positions or Pins Grid is 4 (1 x 4), the device is offered in Through Hole Mounting Type, the device has a Polyamide (PA46), Nylon 4/6, Glass Filled of Housing Material, and Features is Elevated, and the Contact Material Post is Phosphor Bronze, and Contact Material Mating is Phosphor Bronze, and the Contact Finish Thickness Post is 200μin (5.08μm), and Contact Finish Thickness Mating is 200μin (5.08μm), and the Contact Finish Post is Tin, and Contact Finish Mating is Tin.
04745748, with circuit diagram manufactured by INTERSIL. The 04745748, is available in SOP14 Package, is part of the IC Chips.
