9icnet provides you with CUR3105UT-A designed and produced by TDK-Micronas GmbH, which is sold in 9icnet on the spot, and can be purchased through channels such as the original factory and agents. CUR3105UT-A price reference $1.61574. TDK-Micronas GmbH CUR3105UT-A Package/Specification: TO92-UT. You can download CUR3105UT-A english data, pin diagram, Datasheet data sheet function manual, the data contains detailed pin diagrams of diode rectifiers, application circuit diagrams of functions, voltages, usage methods and tutorials.
Prices and stocks marked on 9icnet are for reference only. If you don't find what you are looking for, you can contact us by email or online message, such as CUR3105UT-A price, stock quantity, data sheet and manufacturer. We look forward to your contact and provide you with quality service.
The MM70-314-310B1-1-R300 is MEM SOCKET 314POS RT ANG GOLD, that includes Black Color, they are designed to operate with a MM70 Series, Product is shown on datasheet note for use in a PCI Express, that offers Packaging features such as Cut Tape (CT) Alternate Packaging, Mounting Style is designed to work in SMD/SMT, as well as the Solder Termination, it has an Operating Temperature range of -40°C ~ 85°C. In addition, the Mounting Type is Surface Mount, Right Angle, the device is offered in Board Guide, Latches Features, the device has a Copper Alloy of Contact Material, and Contact Finish is Gold, and the Contact Finish Thickness is 3.9μin (0.10μm), and Number of Positions is 314, and the Pitch is 0.020" (0.50mm), and Number of Rows is 2, and the Gender is Female, and Card Thickness is 0.047" (1.20mm), and the Card Type is MXM 3.0, and Mounting Angle is Right.
The MM70-314-310B1-2-R300 is MEM SOCKET 314POS RT ANG GOLD, that includes Solder Termination, they are designed to operate with a MM70 Series, Product is shown on datasheet note for use in a PCI Express, that offers Pitch features such as 0.020" (0.50mm), Packaging is designed to work in Tape & Reel (TR), it has an Operating Temperature range of -40°C ~ 80°C, the device can also be used as 2 Number of Rows. In addition, the Number of Positions Bay Row is , the device is offered in 314 Number of Positions, the device has a SMD/SMT of Mounting Style, and Mounting Angle is Right, and the Mounting Type is Surface Mount, Right Angle, and Gender is Female, and the Contact Material is Copper Alloy, and Contact Finish Thickness is 12μin (0.30μm), and the Contact Finish is Gold, and Color is Black, and the Card Type is MXM 3.0, and Card Thickness is 0.047" (1.20mm).
MM70-314-310B1-1-T30 with circuit diagram, that includes 0.047" (1.20mm) Card Thickness, they are designed to operate with a MXM 3.0 Card Type, Color is shown on datasheet note for use in a Black, that offers Contact Finish features such as Gold, Contact Finish Thickness is designed to work in 12μin (0.30μm), as well as the Copper Alloy Contact Material, the device can also be used as Female Gender. In addition, the Mounting Type is Surface Mount, Right Angle, the device is offered in 314 Number of Positions, the device has a of Number of Positions Bay Row, and Number of Rows is 2, it has an Operating Temperature range of -40°C ~ 80°C, and Packaging is Bulk, and the Pitch is 0.020" (0.50mm), and Series is MM70, and the Termination is Solder.
MM701V with EDA / CAD Models manufactured by MITSUMI. The MM701V is available in SOP-8 Package, is part of the IC Chips.