Feature
High Capacity
Commercial and Industrial
• 75,000 to 1 Million System Gates
• 27 K to 198 Kbits of Two-Port SRAM
• 66 to 712 User I/Os
Military
• 300, 000 to 1 Million System Gates
• 72 K to 198 Kbits of Two Port SRAM
• 158 to 712 User I/Os
Reprogrammable Flash Technology
• 0.22 µm 4 LM Flash-Based CMOS Process
• Live At Power-Up (LAPU) Level 0 Support
• Single-Chip Solution
• No Configuration Device Required
• Retains Programmed Design during Power-Down/Up Cycles
• Mil/Aero Devices Operate over Full Military Temperature Range
Performance
• 3.3 V, 32-Bit PCI, up to 50 MHz (33 MHz over military temperature)
• Two Integrated PLLs
• External System Performance up to 150 MHz
Secure Programming
• The Industry’s Most Effective Security Key (FlashLock®)
Low Power
• Low Impedance Flash Switches
• Segmented Hierarchical Routing Structure
• Small, Efficient, Configurable (Combinatorial or Sequential) Logic Cells
Commercial and Industrial
• 75,000 to 1 Million System Gates
• 27 K to 198 Kbits of Two-Port SRAM
• 66 to 712 User I/Os
Military
• 300, 000 to 1 Million System Gates
• 72 K to 198 Kbits of Two Port SRAM
• 158 to 712 User I/Os
Reprogrammable Flash Technology
• 0.22 µm 4 LM Flash-Based CMOS Process
• Live At Power-Up (LAPU) Level 0 Support
• Single-Chip Solution
• No Configuration Device Required
• Retains Programmed Design during Power-Down/Up Cycles
• Mil/Aero Devices Operate over Full Military Temperature Range
Performance
• 3.3 V, 32-Bit PCI, up to 50 MHz (33 MHz over military temperature)
• Two Integrated PLLs
• External System Performance up to 150 MHz
Secure Programming
• The Industry’s Most Effective Security Key (FlashLock®)
Low Power
• Low Impedance Flash Switches
• Segmented Hierarchical Routing Structure
• Small, Efficient, Configurable (Combinatorial or Sequential) Logic Cells