9icnet provides you with SIP1X30-041BLF designed and produced by other, which is sold in 9icnet on the spot, and can be purchased through channels such as the original factory and agents. SIP1X30-041BLF price reference $1.015026. other SIP1X30-041BLF Package/Specification: CONN SOCKET SIP 30POS GOLD. You can download SIP1X30-041BLF english data, pin diagram, Datasheet data sheet function manual, the data contains detailed pin diagrams of diode rectifiers, application circuit diagrams of functions, voltages, usage methods and tutorials.
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SIP1X21-011BLF with pin details, that includes SIP1x Series, they are designed to operate with a SIP Type, Packaging is shown on datasheet note for use in a Bulk, that offers Termination features such as Solder, Mounting Type is designed to work in Through Hole, as well as the Closed Frame Features, the device can also be used as Polyphenylene Sulfide (PPS), Glass Filled Housing Material. In addition, the Number of Positions or Pins Grid is 21 (1 x 21), the device is offered in 0.100" (2.54mm) Pitch Mating, the device has a Gold of Contact Finish Mating, and Pitch Post is 0.100" (2.54mm), and the Contact Finish Post is Tin, and Contact Finish Thickness Mating is 10μin (0.25μm), and the Contact Material Mating is Beryllium Copper, and Contact Finish Thickness Post is 200μin (5.08μm), and the Contact Material Post is Brass.
SIP1X27-001BLF with user guide, that includes SIP Type, they are designed to operate with a Solder Termination, Series is shown on datasheet note for use in a SIP1x, that offers Pitch Post features such as 0.100" (2.54mm), Pitch Mating is designed to work in 0.100" (2.54mm), as well as the Bulk Packaging, the device can also be used as 27 (1 x 27) Number of Positions or Pins Grid. In addition, the Mounting Type is Through Hole, the device is offered in Polyphenylene Sulfide (PPS), Glass Filled Housing Material, the device has a Closed Frame of Features, and Contact Material Post is Brass, and the Contact Material Mating is Beryllium Copper, and Contact Finish Thickness Post is 200μin (5.08μm), and the Contact Finish Thickness Mating is 30μin (0.76μm), and Contact Finish Post is Tin, and the Contact Finish Mating is Gold.
SIP1X27-014BLF with circuit diagram, that includes Tin Contact Finish Mating, they are designed to operate with a Tin Contact Finish Post, Contact Finish Thickness Mating is shown on datasheet note for use in a 150μin (3.81μm), that offers Contact Finish Thickness Post features such as 200μin (5.08μm), Contact Material Mating is designed to work in Beryllium Copper, as well as the Brass Contact Material Post, the device can also be used as Closed Frame Features. In addition, the Housing Material is Polyphenylene Sulfide (PPS), Glass Filled, the device is offered in Through Hole Mounting Type, the device has a 27 (1 x 27) of Number of Positions or Pins Grid, and Packaging is Bulk, and the Pitch Mating is 0.100" (2.54mm), and Pitch Post is 0.100" (2.54mm), and the Series is SIP1x, and Termination is Solder, and the Type is SIP.
