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The HD64F3337SF16 is IC MCU 8BIT 60KB FLASH 80QFP, that includes H8R H8/300 Series, they are designed to operate with a Tray Packaging, Package Case is shown on datasheet note for use in a 80-BQFP, it has an Operating Temperature range of -20°C ~ 75°C (TA), Supplier Device Package is designed to work in 80-QFP (14x14), as well as the 74 Number of I O, the device can also be used as 16MHz Speed. In addition, the Core Processor is H8/300, the device is offered in 2K x 8 RAM Size, the device has a FLASH of Program Memory Type, and Peripherals is POR, PWM, WDT, and the Connectivity is Host Interface, I2C, SCI, and Voltage Supply Vcc Vdd is 4.5 V ~ 5.5 V, and the Core Size is 8-Bit, and Program Memory Size is 60KB (60K x 8), and the Data Converters is A/D 8x10b; D/A 2x8b, and Oscillator Type is Internal.
The HD64F3337SF16V is IC MCU 8BIT 60KB FLASH 80QFP, that includes 4.5 V ~ 5.5 V Voltage Supply Vcc Vdd, they are designed to operate with a 80-QFP (14x14) Supplier Device Package, Speed is shown on datasheet note for use in a 16MHz, that offers Series features such as H8R H8/300, RAM Size is designed to work in 2K x 8, as well as the FLASH Program Memory Type, the device can also be used as 60KB (60K x 8) Program Memory Size. In addition, the Peripherals is POR, PWM, WDT, the device is offered in Tray Packaging, the device has a 80-BQFP of Package Case, and Oscillator Type is Internal, it has an Operating Temperature range of -20°C ~ 75°C (TA), and Number of I O is 74, and the Data Converters is A/D 8x10b; D/A 2x8b, and Core Size is 8-Bit, and the Core Processor is H8/300, and Connectivity is Host Interface, I2C, SCI.
HD64F3337F16V with circuit diagram manufactured by RENESAS. The HD64F3337F16V is available in QFP Package, is part of the IC Chips.
HD64F3337SF16CO with EDA / CAD Models manufactured by HITACHI. The HD64F3337SF16CO is available in QFP Package, is part of the IC Chips.
