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EPF6024ABC256-3

  • 描述:电源电压: 3V~3.6V 闸门数量: 24000 供应商设备包装: 256-BGA(27x27) 工作温度: 0摄氏度~85摄氏度(TJ) 安装类别: 表面安装
  • 品牌: 英特尔 (Intel RealSense)
  • 交期:5-7 工作日
渠道:
  • 自营
  • 得捷
  • 贸泽

起订量: 1

  • 库存: 0
  • 单价: ¥453.86909
  • 数量:
    - +
  • 总计: ¥453.87
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规格参数

  • RAM 总位数 -
  • 安装类别 表面安装
  • 工作温度 0摄氏度~85摄氏度(TJ)
  • 电源电压 3V~3.6V
  • 闸门数量 24000
  • 制造厂商 英特尔 (Intel RealSense)
  • 部件状态 过时的
  • 包装/外壳 256-BBGA
  • 逻辑阵列块/可配置逻辑块数量 196
  • 逻辑元件/单元的数量 1960
  • 输入/输出数量 218
  • 供应商设备包装 256-BGA(27x27)

EPF6024ABC256-3 产品详情

The Altera® FLEX 6000 programmable logic device (PLD) family provides a low-cost alternative to high-volume gate array designs. FLEX 6000 devices are based on the OptiFLEX architecture, which minimizes die size while maintaining high performance and routability. The devices have reconfigurable SRAM elements, which give designers the flexibility to quickly change their designs during prototyping and design testing. Designers can also change functionality during operation via in-circuit reconfiguration.

FLEX 6000 devices are reprogrammable, and they are 100% tested prior to shipment. As a result, designers are not required to generate test vectors for fault coverage purposes, allowing them to focus on simulation and design verification. In addition, the designer does not need to manage inventories of different gate array designs. FLEX 6000 devices are configured on the board for the specific functionality required.

Feature

■ Provides an ideal low-cost, programmable alternative to highvolume gate array applications and allows fast design changes
during prototyping or design testing
■ Product features
– Register-rich, look-up table- (LUT-) based architecture
– OptiFLEX® architecture that increases device area efficiency
– Typical gates ranging from 5,000 to 24,000 gates (see Table 1)
– Built-in low-skew clock distribution tree
– 100% functional testing of all devices; test vectors or scan chains
are not required
■ System-level features
– In-circuit reconfigurability (ICR) via external configuration
device or intelligent controller
– 5.0-V devices are fully compliant with peripheral component
interconnect Special Interest Group (PCI SIG) PCI Local Bus
Specification, Revision 2.2
– Built-in Joint Test Action Group (JTAG) boundary-scan test
(BST) circuitry compliant with IEEE Std. 1149.1-1990, available
without consuming additional device logic
– MultiVoltTM I/O interface operation, allowing a device to bridge
between systems operating at different voltages
– Low power consumption (typical specification less than 0.5 mA
in standby mode)
– 3.3-V devices support hot-socketing
EPF6024ABC256-3所属分类:现场可编程门阵列(FPGA),EPF6024ABC256-3 由 英特尔 (Intel RealSense) 设计生产,可通过久芯网进行购买。EPF6024ABC256-3价格参考¥453.869086,你可以下载 EPF6024ABC256-3中文资料、PDF数据手册、Datasheet数据手册功能说明书,可查询EPF6024ABC256-3规格参数、现货库存、封装信息等信息!

英特尔 (Intel RealSense)

英特尔 (Intel RealSense)

英特尔使电子系统设计师能够快速且经济高效地在其市场上进行创新、与众不同并赢得胜利。英特尔提供FPGA、SOC、CPLD和电源解决方案,为全球客户提供高价值的解决方案。

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