The HI-CV CAP 1002 parts manufactured by TDK are available for purchase at 9icnet Electronics. Here you can find various types and values of electronic parts from the world's leading manufacturers. The HI-CV CAP 1002 components of 9icnet Electronics are carefully chosen, undergo stringent quality control, and are successfully meet all required standards.
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The HIC-764-SST is CONN IC DIP SOCKET 64POS GOLD, that includes HIC Series, they are designed to operate with a DIP, 0.75" (19.05mm) Row Spacing Type, Packaging is shown on datasheet note for use in a Tube, that offers Termination features such as Solder, Mounting Type is designed to work in Through Hole, as well as the Open Frame Features, the device can also be used as Polyester, Glass Filled Housing Material. In addition, the Number of Positions or Pins Grid is 64 (2 x 32), the device is offered in 0.070" (1.78mm) Pitch Mating, the device has a Gold of Contact Finish Mating, and Pitch Post is 0.070" (1.78mm), and the Contact Finish Post is Gold, and Contact Finish Thickness Mating is 10μin (0.25μm), and the Contact Material Mating is Beryllium Copper, and Contact Finish Thickness Post is 200μin (5.08μm), and the Contact Material Post is Brass.
The Hi-CV Cap 1001 is KIT CAP CER 10UF AND LARGER, that includes 6.3 ~ 50 V Voltage Rated, they are designed to operate with a ±10%, ±20% Tolerance, Series is shown on datasheet note for use in a C, that offers Quantity features such as 90 Pcs (5 Per Value), Packaging is designed to work in Notebook, as well as the 0603 ~ 2220 (1608 ~ 5750 Metric) Packages Included, the device can also be used as Surface Mount Mounting Type. In addition, the Kit Type is Ceramic, the device is offered in 10μF ~ 100μF Capacitance, the device has a General Purpose of Applications.
HiCORE-i67Q1 with circuit diagram, that includes Bulk Packaging, they are designed to operate with a HiCORE Series.
