The HYC9068R parts manufactured by SMSC are available for purchase at 9icnet Electronics. Here you can find various types and values of electronic parts from the world's leading manufacturers. The HYC9068R components of 9icnet Electronics are carefully chosen, undergo stringent quality control, and are successfully meet all required standards.
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HYC60DREH with pin details, that includes Tray Packaging, they are designed to operate with a Solder Eyelet(s) Termination, it has an Operating Temperature range of -65°C ~ 125°C, that offers Mounting Type features such as Panel Mount, Contact Material is designed to work in Beryllium Copper, as well as the Gold Contact Finish, the device can also be used as 30μin (0.76μm) Contact Finish Thickness. In addition, the Number of Positions is 120, the device is offered in 0.100" (2.54mm) Pitch, the device has a 2 of Number of Rows, and Gender is Female, and the Contact Type is Full Bellows, and Card Thickness is 0.062" (1.57mm), and the Flange Feature is Top Mount Opening, Unthreaded, 0.125" (3.18mm) Dia, and Card Type is Non Specified - Dual Edge, and the Number of Positions Bay Row is 60.
HYC60DRMI with user guide, that includes Wire Wrap Termination, they are designed to operate with a 0.100" (2.54mm) Pitch, Packaging is shown on datasheet note for use in a Tray, it has an Operating Temperature range of -65°C ~ 125°C, Number of Rows is designed to work in 2, as well as the 60 Number of Positions Bay Row, the device can also be used as 120 Number of Positions. In addition, the Mounting Type is Through Hole, the device is offered in Female Gender, the device has a Top Mount Opening, Threaded Insert, 4-40 of Flange Feature, and Contact Type is Loop Bellows, and the Contact Material is Beryllium Copper, and Contact Finish Thickness is 30μin (0.76μm), and the Contact Finish is Gold, and Card Type is Non Specified - Dual Edge, and the Card Thickness is 0.062" (1.57mm).
HYC18DRMI with circuit diagram, that includes 0.062" (1.57mm) Card Thickness, they are designed to operate with a Non Specified - Dual Edge Card Type, Contact Finish is shown on datasheet note for use in a Gold, that offers Contact Finish Thickness features such as 30μin (0.76μm), Contact Material is designed to work in Beryllium Copper, as well as the Loop Bellows Contact Type, the device can also be used as Top Mount Opening, Threaded Insert, 4-40 Flange Feature. In addition, the Gender is Female, the device is offered in Through Hole Mounting Type, the device has a 36 of Number of Positions, and Number of Positions Bay Row is 18, and the Number of Rows is 2, it has an Operating Temperature range of -65°C ~ 125°C, and the Packaging is Tray, and Pitch is 0.100" (2.54mm), and the Series is , and Termination is Wire Wrap.
HYC0UGG0MF2P-5S60E-C with EDA / CAD Models manufactured by HYNIX. The HYC0UGG0MF2P-5S60E-C is available in BGA Package, is part of the IC Chips.