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The 100-018-001 is CONN IC DIP SOCKET 18POS GOLD, that includes 100 Series, they are designed to operate with a DIP, 0.3" (7.62mm) Row Spacing Type, Packaging is shown on datasheet note for use in a Bulk, that offers Termination features such as Solder, it has an Operating Temperature range of -65°C ~ 125°C, as well as the Through Hole Mounting Type, the device can also be used as Closed Frame, Seal Tape Features. In addition, the Housing Material is Polyphenylene Sulfide (PPS), Glass Filled, the device is offered in 18 (2 x 9) Number of Positions or Pins Grid, the device has a 0.100" (2.54mm) of Pitch Mating, and Contact Finish Mating is Gold, and the Pitch Post is 0.100" (2.54mm), and Contact Finish Post is Gold, and the Contact Finish Thickness Mating is 8μin (0.20μm), and Contact Material Mating is Beryllium Copper, and the Contact Finish Thickness Post is Flash, and Contact Material Post is Brass.
100-018-051 with user guide, that includes DIP, 0.3" (7.62mm) Row Spacing Type, they are designed to operate with a Solder Termination, Series is shown on datasheet note for use in a 100, that offers Pitch Post features such as 0.100" (2.54mm), Pitch Mating is designed to work in 0.100" (2.54mm), as well as the Bulk Packaging, it has an Operating Temperature range of -65°C ~ 125°C. In addition, the Number of Positions or Pins Grid is 18 (2 x 9), the device is offered in Through Hole Mounting Type, the device has a Polyphenylene Sulfide (PPS), Glass Filled of Housing Material, and Features is Closed Frame, Seal Tape, and the Contact Material Post is Brass, and Contact Material Mating is Beryllium Copper, and the Contact Finish Thickness Post is Flash, and Contact Finish Thickness Mating is 8μin (0.20μm), and the Contact Finish Post is Gold, and Contact Finish Mating is Gold.
The 100-018-050 is CONN IC DIP SOCKET 18POS GOLD, that includes Gold Contact Finish Mating, they are designed to operate with a Gold Contact Finish Post, Contact Finish Thickness Mating is shown on datasheet note for use in a 8μin (0.20μm), that offers Contact Finish Thickness Post features such as Flash, Contact Material Mating is designed to work in Beryllium Copper, as well as the Brass Contact Material Post, the device can also be used as Open Frame Features. In addition, the Housing Material is Polyphenylene Sulfide (PPS), Glass Filled, the device is offered in Through Hole Mounting Type, the device has a 18 (2 x 9) of Number of Positions or Pins Grid, it has an Operating Temperature range of -65°C ~ 125°C, and the Packaging is Bulk, and Pitch Mating is 0.100" (2.54mm), and the Pitch Post is 0.100" (2.54mm), and Series is 100, and the Termination is Solder, and Type is DIP, 0.3" (7.62mm) Row Spacing.
The 1000-187 is CARD GUIDE BUTTON 1X0.924" BLK, that includes Nylon, Snap-In Mount, 1.000" (25.40mm) Accessory Type, they are designed to operate with a CIRC-O-GIDE? Series, For Use With Related Products is shown on datasheet note for use in a 1/16" (1.6mm) Thick PC Boards.
