FEATURES
High operating voltage (up to 500 V) Pure tin solder contacts on Ni barrier layer provides compatibility with lead (Pb)-free and lead containing soldering processes Metal glaze on high quality ceramic Material categorization: For definitions of compliance please see www.vishay.com/doc?99912
MODEL CASE SIZE INCH 0805 CASE SIZE METRIC RR 2012M POWER RATING W 0.125 LIMITINGELEMENT VOLTAGE UMAX. ACRMS/DC V 400 TEMPERATURE COEFFICIENT � ppm/K TOLERANCE RESISTANCE RANGE to 10M SERIES E96 E24
Notes These resistors do not feature a lifetime limitation when operated within the limits of rated dissipation, permissible operating voltage and permissible film temperature. However, the resistance typically increases due to the resistor's film temperature over operating time, generally known as drift. The drift may exceed the stability requirements of an individual application circuit and thereby limits the functional lifetime. No marking. Power rating depends on the max. temperature at the solder point, the component placement density and the substrate material.
PARAMETER Rated dissipation P70 (1) Limiting element voltage Umax. ACRMS/DC Insulation voltage Uins. (1 min) Voltage coefficient of resistance chart Insulation resistance Operating temperature range Weight UNIT W V ppm/V 0.25 500
Note (1) The power dissipation on the resistors generates a temperature rise against the local ambient, depending on the heat flow support of the printed-circuit board (thermal resistance). The rated dissipation applies only if the permitted film temperature �C is not exceeded.
Product Description: e3 RCV1206 MODEL RCV1206 100 TCR � 100 ppm/K � 200 ppm/K 100K RESISTANCE M 1% TOLERANCE �5% ET1 PACKAGING ET6 e3 LEAD (Pb)-FREE e3 = Pure tin termination finish
Document Number: 20054 1 For technical questions, contact: thickfilmchip@vishay.com THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
MODEL CODE = ET6 QUANTITY Paper tape acc. to IEC 60068-3 Type 4 mm CARRIER TAPE WIDTH PITCH REEL DIAMETER 330 mm/13"
SOLDER PAD DIMENSIONS in millimeters SIZE DIMENSIONS in millimeters REFLOW SOLDERING INCH METRIC 2.0 3.2
Document Number: 20054 2 For technical questions, contact: thickfilmchip@vishay.com THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
PROCEDURE EN 60115-1 IEC 60068-2 CLAUSE TEST METHOD 4.5 4.13 TEST Stability for product types: RCV e3 Resistance Short time overload P 70 Umax.; 5s Solder bath method; Sn60Pb40 non-activated flux; 4.17.2 58 (Td) Solderability Solder bath method; Sn96.5Ag3Cu0.5 non-activated flux; 21 (Uu1) Temperature coefficient Shear (adhesion) Substrate bending 55/20) �C and 205 N Depth 2 mm; 3 times 30 min. - 55 �C; 30 min. 4.19 14 (Na) Rapid change of temperature 5 cycles 1000 cycles (Ba) 30 (Db) 1 (Aa) 13 (M) 30 (Db) Climatic sequence: Dry heat Damp heat, cyclic Cold Low air pressure Damp heat, cyclic DC load 125 �C; h 55 �C; h; 1 cycle - 55 �C; h 1 kPa; � 10) �C; h 55 �C;. h; 5 cycle 0.05 ) Good tinning 95 % covered); no visible damage
No visible damage No visible damage, no open circuit in bent position 0.05 )Document Number: 20054 3 For technical questions, contact: thickfilmchip@vishay.com THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
