The BOOT-KDM parts manufactured by BUSSMANN are available for purchase at 9icnet Electronics. Here you can find various types and values of electronic parts from the world's leading manufacturers. The BOOT-KDM components of 9icnet Electronics are carefully chosen, undergo stringent quality control, and are successfully meet all required standards.
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The BOOSTXL-SENSHUB is BOOSTER PACK SENSOR, that includes TM4C123G For Use With Related Products, they are designed to operate with a Interface Board Accessory Type, Series is shown on datasheet note for use in a LaunchPad?, that offers Product features such as Sensor Hub BoosterPack, Packaging is designed to work in Bulk, as well as the EK-TM4C123GXL For Use With, the device can also be used as Sensor Hub BoosterPack Description Function. In addition, the Interface Type is CAN I2C SPI UART, the device is offered in ARM Cortex M4F Core, the device has a 32 bit 64 bit of Data Bus Width.
The BOOT-KCM is FUSE SEALING BOOT, that includes 1.050 lbs Unit Weight, they are designed to operate with a Insulating Type, Product is shown on datasheet note for use in a Boots, that offers Packaging features such as Bulk, For Use With Related Products is designed to work in UH Series, as well as the Fuse Holders KCM For Use With, the device can also be used as Sealing Boot Accessory Type.
The BOOSTXL-K350QVG-S1 is BOOSTER PACK K350QVG, that includes Displays, LCD Touch Screen Main Purpose, they are designed to operate with a 3.5" 320x240 QVGA Primary Attributes, Utilized IC Part is shown on datasheet note for use in a K350QVG-V2-F.
