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The AS6C3216-55TINTR is IC SRAM 32M LP 2048X16 48TSOP, that includes Tape & Reel (TR) Alternate Packaging Packaging, they are designed to operate with a 48-TFSOP (0.724", 18.40mm Width) Package Case, it has an Operating Temperature range of -40°C ~ 85°C (TA), that offers Interface features such as Parallel, Voltage Supply is designed to work in 2.7 V ~ 3.6 V, as well as the 48-TSOP I Supplier Device Package, the device can also be used as 32M (2M x 16) Memory Size. In addition, the Memory Type is SRAM - Asynchronous, the device is offered in 55ns Speed, the device has a RAM of Format Memory.
The AS6C3216-55TIN is IC SRAM 32MBIT 55NS 48TSOP, that includes 2.7 V ~ 3.6 V Voltage Supply, they are designed to operate with a 48-TSOP I Supplier Device Package, Speed is shown on datasheet note for use in a 55ns, that offers Packaging features such as Tray Alternate Packaging, Package Case is designed to work in 48-TFSOP (0.724", 18.40mm Width), it has an Operating Temperature range of -40°C ~ 85°C (TA), the device can also be used as SRAM - Asynchronous Memory Type. In addition, the Memory Size is 32M (2M x 16), the device is offered in Parallel Interface, the device has a RAM of Format Memory.
AS6C3216-55BINTR with circuit diagram, that includes RAM Format Memory, they are designed to operate with a Parallel Interface, Memory Size is shown on datasheet note for use in a 32M (2M x 16), that offers Memory Type features such as SRAM - Asynchronous, it has an Operating Temperature range of -40°C ~ 85°C (TA), as well as the 48-LFBGA Package Case, the device can also be used as Tape & Reel (TR) Alternate Packaging Packaging. In addition, the Speed is 55ns, the device is offered in 48-TFBGA (8x10) Supplier Device Package, the device has a 2.7 V ~ 3.6 V of Voltage Supply.
AS6C3216-55BIN with EDA / CAD Models, that includes Tray Alternate Packaging Packaging, they are designed to operate with a SRAM - Asynchronous Memory Type, Format Memory is shown on datasheet note for use in a RAM, that offers Interface features such as Parallel, Speed is designed to work in 55ns, as well as the 48-TFBGA (8x10) Supplier Device Package, the device can also be used as 48-LFBGA Package Case, it has an Operating Temperature range of -40°C ~ 85°C (TA), the device is offered in 32M (2M x 16) Memory Size, the device has a 2.7 V ~ 3.6 V of Voltage Supply.
